LFE2M35SE-5FN256C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 140 2151424 34000 256-BGA |
|---|---|
| Quantity | 136 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 140 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4250 | Number of Logic Elements/Cells | 34000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2151424 |
Overview of LFE2M35SE-5FN256C – ECP2M Field Programmable Gate Array (FPGA) IC 140 2151424 34000 256-BGA
The LFE2M35SE-5FN256C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor. It delivers 34,000 logic elements, approximately 2.15 Mbits of on-chip RAM, and 140 I/O pins in a 256-ball FPBGA (17×17) surface-mount package.
This device operates from a 1.14 V to 1.26 V supply and is specified for commercial temperature operation from 0°C to 85°C. It is RoHS compliant.
Key Features
- Logic Capacity — 34,000 logic elements supported; the device also lists 4,250 logic array blocks for block-level capacity planning.
- Embedded Memory — Approximately 2.15 Mbits of on-chip RAM to support buffering, state storage, and intermediate data processing.
- I/O Resources — 140 I/O pins to accommodate multi-channel interfaces and external connectivity.
- Power Supply — Operates from a 1.14 V to 1.26 V supply range for core power compatibility.
- Package and Mounting — Supplied in a 256-FPBGA (17×17) surface-mount package (256-BGA footprint) for compact board integration.
- Commercial Temperature Grade — Rated for 0°C to 85°C operation, suitable for standard commercial applications.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- Substantial logic density: 34,000 logic elements provide room for medium-complexity designs without external gate arrays.
- On-chip memory capacity: Approximately 2.15 Mbits of RAM reduces dependence on external memory for many buffering and state tasks.
- Ample I/O count: 140 I/O pins support integration with multiple peripherals and interface lanes on a single device.
- Compact packaging: 256-FPBGA (17×17) surface-mount package allows higher-density board layouts while maintaining robust pin count.
- Clear power and thermal parameters: Documented 1.14–1.26 V supply range and 0°C to 85°C rating enable straightforward power budgeting and thermal planning.
Why Choose LFE2M35SE-5FN256C?
The LFE2M35SE-5FN256C combines mid-range logic capacity with on-chip RAM and a substantial I/O complement in a compact 256-BGA package, making it suitable for designs that require integrated programmable logic, embedded memory, and multiple external interfaces within commercial temperature constraints.
Its clear electrical and packaging specifications simplify hardware integration and BOM decisions, offering a balance of integration and predictability for engineers and procurement teams pursuing reliable FPGA-based designs.
Request a quote or submit a procurement inquiry to receive pricing and availability information for the LFE2M35SE-5FN256C.
