LFE2M35SE-5FN672C

The LFE2M35SE-5FN672C is an ECP2M family Field Programmable Gate Array (FPGA) in a 672-ball BGA package designed for commercial applications. It provides a high-density programmable fabric with 34,000 logic elements and approximately 2.15 Mbits of embedded memory for designs that require substantial on-chip logic and storage.

With a broad I/O count and a low-voltage core supply range, this device targets applications that demand large logic capacity, extensive interfacing, and compact board-level integration in surface-mount BGA format.

Key Features

• Core Capacity  34,000 logic elements provide significant programmable logic resources for complex designs.
• Embedded Memory  Approximately 2.15 Mbits of on-chip RAM to support data buffering, lookup tables, and local storage.
• I/O Resources  410 user I/O pins support extensive peripheral and interface connections.
• Power  Core voltage supply range of 1.14 V to 1.26 V for the FPGA fabric.
• Package and Mounting  672-BBGA package (supplier package: 672-FPBGA, 27×27 mm) designed for surface-mount assembly.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Logic-Intensive Embedded Designs  Implement custom, high-density programmable logic functions using the device's 34,000 logic elements and embedded memory.
• I/O-Heavy Interface Bridging  Use the 410 I/O pins to connect multiple peripherals, bridges, or protocol converters on a single FPGA.
• On-Board Data Buffering and Local Storage  Leverage approximately 2.15 Mbits of on-chip RAM for buffering, packet staging, or temporary data storage close to logic functions.

Unique Advantages

• High Logic Density: 34,000 logic elements enable complex logic implementations without external glue logic, reducing BOM and board area.
• Substantial Embedded Memory: Approximately 2.15 Mbits of RAM provides on-chip storage to support data-intensive algorithms and reduce external memory needs.
• Extensive I/O Count: 410 user I/Os facilitate multiple interface connections and flexible board-level partitioning.
• Compact BGA Packaging: The 672-BBGA (27×27 mm) package delivers high integration density suitable for space-constrained boards.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match standard commercial electronic environments.
• RoHS Compliance: Environmentally compliant manufacturing and materials.

Why Choose LFE2M35SE-5FN672C?

The LFE2M35SE-5FN672C balances high programmable logic capacity, on-chip memory, and large I/O resources in a single surface-mount BGA package. Its specifications make it well suited for designers needing substantial in-device logic and local memory while maintaining a compact footprint and standard commercial temperature operation.

For developers and procurement teams building medium- to high-density FPGA-based systems, this device offers a combination of integration and flexibility that supports scalable designs and reduces external component count.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2M35SE-5FN672C.