LFE2M35SE-6F484C

The LFE2M35SE-6F484C is a field programmable gate array (FPGA) IC from Lattice's ECP2M family, delivered in a 484-ball fine-pitch BGA package. It provides a balance of programmable logic, on-chip embedded memory and high I/O density for commercial electronic designs.

Key on-chip resources include 34,000 logic elements, approximately 2.15 Mbits of embedded memory, and 303 I/O pins. The device operates from a 1.14 V to 1.26 V supply and is rated for commercial temperature operation (0 °C to 85 °C). The device is RoHS compliant and supplied in a 484-FPBGA (23×23) surface-mount package.

Key Features

• Core Logic 34,000 logic elements provide programmable fabric for custom digital logic and system integration.
• Embedded Memory Approximately 2.15 Mbits of on-chip RAM for buffering, FIFOs and local storage without external memory.
• I/O Capacity 303 I/O pins to support wide parallel interfaces, peripheral connections and board-level routing flexibility.
• Power Low-voltage core operation from 1.14 V to 1.26 V, enabling integration with modern low-voltage power rails.
• Package & Mounting 484-ball fine-pitch BGA (484-FPBGA, 23×23) in a surface-mount package for compact, high-density PCB implementations.
• Operating Range & Grade Commercial grade operation with a specified temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• Custom Logic Implementation — Use the device to implement application-specific digital functions and hardware acceleration using 34,000 logic elements.
• Memory-Intensive Functions — Approximately 2.15 Mbits of embedded RAM supports buffering, data aggregation and on-chip storage tasks.
• High-Density I/O Systems — 303 I/O pins accommodate complex peripheral interfacing and board-level signal distribution.
• Compact Embedded Systems — The 484-FPBGA surface-mount package enables compact PCB layouts where space and I/O density are important.

Unique Advantages

• Significant Logic Capacity: 34,000 logic elements allow substantial on-chip implementation of custom digital functions, reducing reliance on multiple discrete components.
• On-Chip Memory Resources: Approximately 2.15 Mbits of embedded RAM reduces external memory needs and simplifies board design for buffering and temporary storage.
• High I/O Count: 303 I/O pins provide flexibility for diverse interface requirements and parallel data paths.
• Compact, High-Density Package: 484-FPBGA (23×23) enables dense PCB integration while maintaining robust connectivity for many signals.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation, suited to a wide range of commercial electronic applications.
• RoHS Compliance: Conforms to lead-free manufacturing requirements for easier regulatory compliance.

Why Choose LFE2M35SE-6F484C?

The LFE2M35SE-6F484C is positioned for designers who need a commercially rated FPGA that combines substantial programmable logic, embedded memory and a high I/O count in a compact BGA package. Its specification set enables integration of complex digital functions and on-chip data handling while maintaining a small board footprint.

For teams targeting commercial embedded designs that require flexible, on-board programmable logic and memory resources, this device offers a clear set of verifiable capabilities. Detailed electrical and timing specifications are provided in the manufacturer's ECP2M family datasheet for design validation and integration planning.

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