LFE2M35SE-6F672C

The LFE2M35SE-6F672C is an ECP2M family field programmable gate array (FPGA) supplied in a 672-ball BGA package. It delivers a balance of logic capacity, embedded memory and I/O density suited for mid-range system integration in commercial applications.

With 34,000 logic elements, approximately 2.15 Mbits of embedded RAM and 410 I/Os, this device targets communication, data processing and interface-intensive designs that require programmable logic, on-chip memory and flexible I/O in a compact surface-mount package.

Key Features

• Logic Capacity — 34,000 logic elements provide fabric resources for medium-complexity FPGA designs.
• Embedded Memory — Approximately 2.15 Mbits of on-chip RAM for buffering, frame storage and embedded data structures.
• I/O Density — 410 user I/Os support extensive external device interfacing and multi-bank connectivity.
• High‑Speed Serial Capability (Family Feature) — ECP2M family devices include embedded SERDES supporting data rates from 250 Mbps to 3.125 Gbps and up to 16 channels per device for high-speed serial protocols.
• DSP and Clock Resources (Family Feature) — Family-level sysDSP blocks and multiple PLL/DLL resources enable multiply–accumulate operations and flexible clock management for signal processing tasks.
• Programmable sysI/O™ Buffer Support — I/O supports a wide range of standards (LVTTL, LVCMOS, LVDS, SSTL, HSTL and related differential interfaces) for compatibility with common board-level signaling.
• Package & Mounting — 672-ball FPBGA (27 × 27 mm) in a surface-mount form factor for space-efficient board designs.
• Power — Core voltage supply range 1.14 V to 1.26 V (1.2 V nominal) for integration into standard power rails.
• Commercial Temperature Grade — Specified operating range 0 °C to 85 °C for commercial applications.
• Compliance — RoHS compliant.

Typical Applications

• Networking & Communications — Implements protocol adapters, packet buffering and interface bridging where on-chip RAM and high-speed serial links are required.
• Data Acquisition & DSP — Leverages embedded memory and sysDSP-family capabilities for preprocessing, filtering and real-time signal tasks.
• Embedded System Integration — Acts as a central programmable fabric for sensor aggregation, custom logic offload and glue logic in compact commercial products.
• High-Speed Interface Bridging — Supports source-synchronous and serial interface applications that require flexible I/O standards and SERDES-level throughput.

Unique Advantages

• Balanced Resource Set: 34,000 logic elements with substantial on-chip memory and 410 I/Os provide a strong mix of compute, storage and connectivity for mid-range designs.
• High-Density Package: 672-ball FPBGA (27×27 mm) enables high I/O counts and compact board integration for space-constrained systems.
• High‑Speed Serial Support (Family Feature): Embedded SERDES (250 Mbps–3.125 Gbps, up to 16 channels) enables connectivity to common high-speed serial protocols without external transceivers.
• Flexible I/O Standards: Programmable I/O buffer options support a broad set of single-ended and differential standards for ease of board-level integration.
• Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for deployment in standard commercial products.
• Design Ecosystem Support (Family Feature): The ECP2M family is supported by Lattice design tools for efficient implementation of complex designs.

Why Choose LFE2M35SE-6F672C?

This FPGA delivers a practical combination of logic, embedded memory and high I/O density in a compact 672‑ball BGA package, making it suitable for communications, data processing and embedded integration in commercial products. Its core voltage range and commercial temperature rating simplify system power and thermal planning for typical applications.

Choosing the LFE2M35SE-6F672C provides designers with scalable on-chip resources and family-level capabilities—such as SERDES and sysDSP blocks—backed by established design tools, enabling robust implementation and future design iterations.

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