LFE2M35SE-6F256C

The LFE2M35SE-6F256C is an ECP2M Field Programmable Gate Array (FPGA) from Lattice Semiconductor, supplied in a 256-ball BGA package for surface-mount applications. It delivers programmable logic capacity with 34,000 logic elements and embedded memory to support custom digital designs.

With up to 140 user I/O, approximately 2.15 Mbits of on‑chip RAM, and a 1.14 V to 1.26 V supply range, this commercial‑grade device targets designs that require moderate logic density, significant on‑chip memory, and a compact BGA footprint.

Key Features

• Logic Capacity — 34,000 logic elements and 4,250 configurable logic blocks (CLBs) provide the programmable fabric for implementing custom digital functions.
• Embedded Memory — Approximately 2.15 Mbits of on‑chip RAM usable for buffers, FIFOs, or embedded data storage.
• I/O Density — 140 user I/O pins to support multiple interfaces and external peripherals.
• Power — Core supply range of 1.14 V to 1.26 V to match platform power requirements.
• Package and Mounting — 256-ball FBGA (256-FPBGA, 17 × 17 mm) package in a surface-mount form factor for space-efficient board designs.
• Operating Range — Commercial operating temperature range from 0 °C to 85 °C for standard electronics environments.
• Compliance — RoHS compliant.

Typical Applications

• Custom Logic Acceleration — Implement application‑specific processing and control functions using the device's 34,000 logic elements and embedded memory.
• I/O Expansion and Protocol Bridging — Use the 140 available I/O pins to adapt, aggregate, or bridge between interfaces in compact systems.
• Embedded Data Buffering — Leverage approximately 2.15 Mbits of on‑chip RAM for buffering, FIFO storage, or temporary data retention within digital designs.

Unique Advantages

• Balanced Logic and Memory — A combination of 34,000 logic elements and ~2.15 Mbits of RAM supports both computation and local data storage without needing external memory for many applications.
• High I/O Count in a Compact Package — 140 user I/O in a 256‑ball FBGA enables dense connectivity while keeping board area small.
• Commercial‑Grade Operating Range — Specified 0 °C to 85 °C operation aligns with a wide range of standard electronics applications.
• RoHS Compliance — Meets RoHS requirements for material content in compliant manufacturing processes.
• Surface‑Mount Compatibility — 256‑BGA surface‑mount package eases integration into modern PCB assembly workflows.

Why Choose LFE2M35SE-6F256C?

The LFE2M35SE-6F256C positions itself as a versatile FPGA option for designs that need a balance of programmable logic, embedded memory, and high I/O density in a compact BGA package. Its 34,000 logic elements and approximately 2.15 Mbits of on‑chip RAM make it suitable for applications requiring local data storage and custom digital logic without relying solely on external components.

This commercial‑grade device is well suited to development and production environments that operate within standard temperature and power ranges, offering RoHS compliance and a surface‑mount 256‑ball FBGA footprint for streamlined board integration.

Request a quote or submit a pricing inquiry for the LFE2M35SE-6F256C to evaluate availability and lead time for your next design.