LFE2M35SE-5FN484C

The LFE2M35SE-5FN484C is a Lattice Semiconductor ECP2M family field programmable gate array (FPGA) in a 484-ball BBGA package. The device delivers a balance of logic density, embedded memory and flexible I/O tailored for communication, networking and system integration tasks.

Designed for surface-mount assembly, this commercial-grade FPGA provides 34,000 logic elements, approximately 2.15 Mbits of embedded memory and 303 user I/Os, with supply voltage between 1.14 V and 1.26 V and an operating range of 0 °C to 85 °C.

Key Features

• Logic Capacity  34,000 logic elements to implement mid-range FPGA designs and system integration tasks.
• Embedded Memory  Approximately 2.15 Mbits of on-chip RAM for buffering, packet handling and local data storage.
• I/O Density & Flexibility  303 user I/Os available in a 484‑ball FPBGA (23 × 23 mm) package to support wide peripheral and bus interfacing.
• High‑speed SERDES (Family Capability)  ECP2M family devices include embedded SERDES supporting multi‑hundred Mbps to multi‑Gbps links and common protocols (family-level feature).
• DSP and Math Acceleration (Family Capability)  Enhanced sysDSP blocks are provided in the family for high‑performance multiply/accumulate functions (family-level feature).
• Clocking and Timing  On‑chip PLLs and DLLs from the family architecture enable clock multiply/divide and phase/delay adjustments (family-level feature).
• Configuration Features  Family supports flexible configuration options including SPI boot flash interface and dual boot image support (family-level feature).
• Power & Thermal  Nominal supply voltage range of 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C.
• Package & Mounting  484‑BBGA (supplier package: 484‑FPBGA 23 × 23 mm); surface mount device suitable for compact system boards.
• Regulatory  RoHS compliant.

Typical Applications

• High‑speed communications: Implement protocol bridging and packet processing leveraging the ECP2M family SERDES and high I/O count for interfaces such as Ethernet and serial links (family-level capability).
• Networking equipment: Use the device for switch, router or interface controller functions where embedded memory and DSP resources accelerate buffering and data manipulation.
• Data acquisition and processing: Combine the device's logic capacity and sysDSP resources (family feature) for front‑end signal conditioning, filtering and processing in compact systems.
• Memory interface controllers: Support DDR and source‑synchronous interfaces with the family’s dedicated DDR features for memory subsystems (family-level capability).

Unique Advantages

• Balanced mid‑range capacity: 34,000 logic elements and substantial embedded RAM provide the right mix of resources for mid‑complexity designs without overprovisioning.
• High I/O count in compact package: 303 user I/Os in a 23 × 23 mm 484‑FPBGA enables dense connectivity in space‑constrained boards.
• Flexible configuration and boot options: Family configuration features such as SPI boot and dual image support simplify field updates and deployment strategies.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant, suitable for mainstream embedded and networking products.
• Surface mount, production‑friendly package: 484‑BBGA surface-mount format integrates into modern PCB assembly flows.

Why Choose LFE2M35SE-5FN484C?

The LFE2M35SE-5FN484C positions itself as a capable mid‑range FPGA option within the Lattice ECP2M family, combining 34,000 logic elements, approximately 2.15 Mbits of embedded memory and 303 I/Os in a compact 484‑ball BBGA package. It is suited to developers who need a balance of logic density, on‑chip memory and flexible I/O for communication, networking and embedded signal processing applications.

Backed by the ECP2M family architecture—featuring enhanced DSP capabilities, high‑speed SERDES (family feature) and rich clocking/configuration options—this device offers a scalable path for designs that require reliable, production‑oriented FPGA resources in a commercial‑grade package.

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