LFE2M35SE-5FN256I

The LFE2M35SE-5FN256I is a Field Programmable Gate Array (FPGA) supplied in a 256-BGA package and rated for industrial use. It integrates 34,000 logic elements, approximately 2.15 Mbits of embedded memory, and 140 general-purpose I/O pins to support mid-density programmable logic applications.

Designed for surface-mount assembly and RoHS-compliant production, the device operates from a 1.14 V to 1.26 V supply and across an industrial temperature range of −40 °C to 100 °C, enabling deployment in robust embedded systems.

Key Features

• Logic Capacity  34,000 logic elements provide programmable resources for custom digital functions and moderate-complexity designs.
• Embedded Memory  Approximately 2.15 Mbits of on-chip RAM for data buffering, FIFOs, and local storage of configuration or runtime data.
• I/O Resources  140 I/O pins support a variety of external interfaces and parallel or serial connectivity for system integration.
• Power Supply  Operates from a 1.14 V to 1.26 V core supply to match system power rails and design constraints.
• Package & Mounting  256-FPBGA (17×17) package in a 256-BGA case, optimized for surface-mount PCB assemblies where area and pin count matter.
• Temperature & Grade  Industrial grade device rated for operation between −40 °C and 100 °C for reliable performance in demanding environments.
• Compliance  RoHS-compliant for environmental and regulatory alignment in commercial and industrial products.

Typical Applications

• Industrial Control  Programmable logic and abundant I/O enable custom control functions, sensor interfacing, and real-time processing in factory automation and machine control systems.
• Embedded Processing  On-chip memory and logic density support glue logic, protocol bridging, and hardware-accelerated tasks in embedded systems.
• Communications Interfaces  Generous I/O count allows implementation of parallel or serial interface logic and protocol handling for data acquisition and distribution.

Unique Advantages

• Balanced Logic and Memory: The combination of 34,000 logic elements and ~2.15 Mbits of embedded RAM enables mixed-control and data-path implementations without large external memory requirements.
• High I/O Count: With 140 available I/Os, the device simplifies board-level integration by reducing the need for additional interface components.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments typical of industrial applications.
• Compact Packaging: 256-FPBGA (17×17) footprint supports dense PCB layouts while providing substantial pin density for system signals.
• RoHS Compliance: Meets RoHS requirements for environmentally conscious manufacturing and product deployment.

Why Choose LFE2M35SE-5FN256I?

The LFE2M35SE-5FN256I positions itself as a mid-density, industrial-grade FPGA that balances programmable logic capacity, embedded memory, and a high I/O count in a compact 256-BGA package. Its supply voltage window and extended operating temperature range make it suitable for embedded designs that require reliable operation and flexible I/O integration.

This device is appropriate for engineers and procurement teams building industrial control, embedded processing, and communications interface solutions who need a field-programmable platform with verified on-chip resources and RoHS compliance.

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