LFE2M35SE-5F672I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 410 2151424 34000 672-BBGA |
|---|---|
| Quantity | 664 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 410 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4250 | Number of Logic Elements/Cells | 34000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2151424 |
Overview of LFE2M35SE-5F672I – ECP2M FPGA, approximately 34,000 logic elements, 672-BBGA
The LFE2M35SE-5F672I is an industrial-grade Field Programmable Gate Array (FPGA) IC from the Lattice ECP2M family, delivered in a 672-ball BGA (27 × 27 mm) surface-mount package. It combines high logic capacity, substantial on-chip memory and a large I/O count to address communications, signal processing and industrial control applications.
Designed for system integration, this device supports low-voltage operation (1.14 V to 1.26 V) and wide operating temperatures (−40 °C to 100 °C), making it suitable for deployed equipment that requires sustained performance in industrial environments.
Key Features
- Core Logic Approximately 34,000 logic elements, providing the fabric capacity for complex RTL and system-level integration.
- Embedded Memory Approximately 2.15 Mbits of on-chip RAM, suitable for buffering, packet handling and local data storage.
- I/O Density Up to 410 device I/Os to support extensive peripheral and bus interfacing on multi-functional boards.
- High-Speed Serial and Interface Support (family-level) The Lattice ECP2M family includes embedded SERDES and PCS blocks with support for a range of serial protocols and multi-gigabit links (family-level feature).
- DSP and Arithmetic Acceleration (family-level) Family-level sysDSP blocks provide multiply-accumulate resources for signal processing and algorithm acceleration.
- Clocking and Timing (family-level) Family-level support for multiple PLLs and DLLs enables clock multiplication, division and phase/delay adjustment for complex clocking domains.
- Package & Mounting 672-ball FPBGA (27 × 27 mm) surface-mount package for compact, board-level deployment.
- Operating Voltage & Temperature Low-voltage core supply from 1.14 V to 1.26 V and an industrial operating range of −40 °C to 100 °C.
- Regulatory RoHS compliant.
Typical Applications
- Telecommunications & Networking — Implement protocol engines, packet processing and high-speed serial interfaces using family-level SERDES and the device's high I/O count.
- Industrial Control & Automation — Use the industrial-grade operating range and extensive I/O for real-time control, sensor aggregation and field interface logic.
- Signal Processing & Acceleration — Leverage on-chip memory and family-level DSP resources for filtering, encoding/decoding and other compute-intensive tasks.
- Embedded Systems & Prototyping — Fit complex glue-logic, custom peripherals and system integration functions within a single FPGA fabric with large logic and memory resources.
Unique Advantages
- Substantial logic capacity: Approximately 34,000 logic elements enable consolidation of multiple functions and IP blocks on a single device, reducing external logic count.
- Generous on-chip memory: Approximately 2.15 Mbits of embedded RAM supports buffering, FIFOs and local data storage without immediate dependence on external memory.
- High I/O density: 410 I/Os provide flexibility for multi-channel interfaces, parallel buses and mixed-signal front-ends.
- Industrial robustness: Rated for −40 °C to 100 °C and RoHS compliant, suitable for long-life industrial deployments.
- Compact BGA package: 672-ball 27 × 27 mm FPBGA offers a balance of board-level density and routeability for complex PCBs.
- Family-level serial and DSP features: Access to high-speed serial, DSP blocks and flexible clocking available across the Lattice ECP2M family for designs that require high-performance interfaces and arithmetic acceleration.
Why Choose LFE2M35SE-5F672I?
The LFE2M35SE-5F672I positions itself as a capable mid-to-high density FPGA option for system designers who need significant logic resources, embedded memory and a high I/O count in an industrial-grade package. Its low-voltage operation and extended temperature range make it appropriate for deployed telecommunications, industrial automation and embedded compute applications.
Choosing this device offers designers the ability to consolidate functionality, reduce external components and rely on family-level features—such as high-speed serial support and DSP acceleration—when scaling system performance or migrating designs across the Lattice ECP2M family.
If you would like pricing, availability or to request a formal quote for LFE2M35SE-5F672I, submit an inquiry to request a quote and our product team will respond with next steps.