LFE2M35SE-5FN484I

The LFE2M35SE-5FN484I is a Lattice ECP2M family field programmable gate array (FPGA) supplied in a 484-ball BGA package. It delivers 34,000 logic elements with approximately 2.15 Mbits of embedded memory and a high I/O count for designs that require significant on-chip logic and connectivity.

Designed for industrial environments, this surface-mount FPGA supports an operating voltage window of 1.14 V to 1.26 V and an operating temperature range from −40 °C to 100 °C, offering a balance of integration and robustness for demanding embedded applications.

Key Features

• Core Capacity  34,000 logic elements provide substantial programmable logic resources for custom digital implementations.
• Embedded Memory  Approximately 2.15 Mbits of on-chip RAM enables local buffering, state storage, and small memory-intensive functions without external memory.
• I/O Density  303 I/O pins support complex interfacing and connectivity requirements for multi-signal systems.
• Power  Supported supply voltage range of 1.14 V to 1.26 V for core power delivery within specified limits.
• Package and Mounting  484-ball BGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board integration.
• Temperature and Grade  Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployment in temperature-sensitive environments.
• Compliance  RoHS-compliant construction for regulated manufacturing environments.

Typical Applications

• Industrial Control  Use the device’s industrial temperature rating and high I/O count for sensor interfacing, motor control logic, and factory automation functions.
• Communications Infrastructure  Leverage the large logic element count and on-chip memory to implement protocol processing and custom packet-handling engines.
• Test & Measurement  High I/O density and embedded RAM support data acquisition front-ends and real-time signal preprocessing.
• Embedded System Integration  Compact 484-BBGA packaging and surface-mount mounting make the device suitable for space-constrained boards requiring significant programmable logic.

Unique Advantages

• Substantial Logic Resources: 34,000 logic elements allow for complex custom logic and parallel processing architectures on a single device.
• On-Chip Memory: Approximately 2.15 Mbits of embedded RAM reduces reliance on external memory for buffering and state retention, simplifying board design.
• High I/O Count: 303 I/O pins provide flexibility for connecting multiple peripherals, sensors, and high-pin-count interfaces without external expanders.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compact BGA Package: 484-ball FPBGA (23×23) offers a high-density, surface-mount solution for systems where PCB space is limited.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and product rollout.

Why Choose LFE2M35SE-5FN484I?

The LFE2M35SE-5FN484I positions itself as a robust, industrial-grade FPGA option that combines sizable logic density, meaningful embedded memory, and extensive I/O in a compact BGA package. Its specified voltage range and industrial temperature rating make it suitable for embedded designs that require reliable operation across a wide thermal window.

Choose this FPGA for designs that need a balance of programmable logic capacity, on-chip RAM, and board-level integration in industrial and embedded systems. The device’s combination of resources supports scalability from prototyping to production where space, temperature tolerance, and I/O flexibility are key considerations.

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