LFE2M35SE-5FN672I

The LFE2M35SE-5FN672I is an ECP2M family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a balance of logic capacity, embedded memory, and high I/O density for industrial and embedded designs.

With 34,000 logic elements, approximately 2.15 Mbits of on-chip RAM and 410 I/O pins in a compact 672-ball BGA package, this device targets applications that require significant reconfigurable logic, substantial embedded memory and broad system connectivity while operating across an industrial temperature range.

Key Features

• Core Logic  34,000 logic elements to implement complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 2.15 Mbits of on-chip RAM to support buffering, FIFOs and intermediate data storage.
• I/O Capacity  410 user I/O pins for extensive peripheral and system interconnection.
• Power Supply  Operates from a core voltage supply of 1.14 V to 1.26 V.
• Package & Mounting  672-ball BGA package (supplier package: 672-FPBGA 27×27) designed for surface-mount PCB assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance  RoHS compliant for lead-free assembly requirements.

Typical Applications

• Industrial Control  Implement control logic, I/O aggregation and protocol adaptation for factory automation and machine control systems leveraging the device’s high logic density and wide temperature rating.
• Data Aggregation and Interface Bridging  Use the 410 I/Os and on-chip memory to collect, format and buffer signals between sensors, actuators and host controllers.
• Embedded System Acceleration  Offload compute-intensive or latency-sensitive tasks into programmable logic using the device’s sizeable logic element count and embedded RAM.

Unique Advantages

• High logic capacity: 34,000 logic elements enable implementation of sizable custom logic blocks and parallel processing paths.
• Substantial on-chip memory: Approximately 2.15 Mbits of embedded RAM provides local storage for buffering, state machines and intermediate data without external memory.
• Extensive I/O availability: 410 I/O pins simplify system integration by reducing the need for external multiplexing or I/O expanders.
• Industrial operation: −40 °C to 100 °C operating range supports deployment in demanding environments.
• Compact BGA footprint: 672-ball FPBGA (27×27) package offers a dense package for space-constrained boards while supporting surface-mount assembly.
• RoHS compliant: Meets lead-free manufacturing requirements for modern production processes.

Why Choose LFE2M35SE-5FN672I?

The LFE2M35SE-5FN672I positions itself as a capable FPGA option for industrial and embedded designs that need a combination of high logic density, substantial embedded memory and broad I/O connectivity in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for deployable, production-grade systems.

Designers building complex control, interface or acceleration functions will find the device’s specifications align with needs for on-chip resources and system integration, enabling streamlined BOMs and reduced reliance on external components.

Request a quote or contact sales to discuss pricing, availability and integration support for the LFE2M35SE-5FN672I.