LFE2M35SE-6F256I

The LFE2M35SE-6F256I is an ECP2M field programmable gate array (FPGA) IC manufactured by Lattice Semiconductor Corporation. It provides a programmable logic platform with 34,000 logic elements, approximately 2.15 Mbits of embedded memory, and 140 user I/O in a 256-ball BGA package.

Designed for industrial applications, the device supports a supply voltage range of 1.14 V to 1.26 V, is RoHS compliant, and operates across an industrial temperature range of −40 °C to 100 °C, making it suitable for deployments that require extended temperature tolerance and compact surface-mount assembly.

Key Features

• Core Logic  Contains 34,000 logic elements to implement custom digital functions and programmable logic.
• Embedded Memory  Approximately 2.15 Mbits of on-chip RAM (2,151,424 bits) for data buffering, state storage, and memory-mapped logic functions.
• I/O Density  140 general-purpose I/O pins provide flexible external interfacing for peripherals and buses.
• Power  Operates from a core voltage supply between 1.14 V and 1.26 V to meet system power requirements.
• Package & Mounting  256-ball BGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for high-density PCB designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Regulatory Compliance  RoHS compliant, supporting environmental and materials restrictions.

Typical Applications

• Industrial Control  Programmable logic and I/O capacity well-suited for control, signal processing, and interface tasks in industrial systems operating across wide temperature ranges.
• Embedded Systems  On-chip memory and abundant logic elements enable integration of custom processing, glue logic, and peripheral management in compact embedded designs.
• Interface Bridging  Large I/O count allows implementation of protocol translators and I/O expansion where multiple external interfaces must be connected and managed.

Unique Advantages

• Balanced Logic and Memory: Combines 34,000 logic elements with approximately 2.15 Mbits of embedded RAM, enabling substantial on-chip functionality without external memory in many designs.
• High I/O Count: 140 I/O pins provide flexibility to connect numerous peripherals and external buses, reducing the need for glue logic.
• Compact Surface-Mount Package: 256-ball FPBGA (17×17) provides a dense footprint for space-constrained PCBs while supporting high pin counts.
• Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Low-Voltage Core: Core supply range of 1.14 V to 1.26 V aligns with modern low-voltage system designs.
• RoHS Compliant: Meets material restriction requirements for environmentally conscious product design.

Why Choose LFE2M35SE-6F256I?

The LFE2M35SE-6F256I positions itself as a practical FPGA option that combines a substantial number of logic elements, significant on-chip memory, and a high I/O count in a compact 256-BGA surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for products that must operate reliably in extended temperature ranges while meeting environmental material standards.

This device is appropriate for engineering teams building embedded systems, industrial controllers, and interface-rich designs that require programmable hardware resources and dense I/O in a small footprint. Backed by Lattice Semiconductor Corporation manufacturing, it offers a configurable hardware foundation for scalable, long-term deployments.

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