LFE2M35SE-6F672I

The LFE2M35SE-6F672I is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation designed for industrial applications. It delivers a reprogrammable logic platform with 34,000 logic elements, approximately 2.15 Mbits of embedded memory, and a high I/O count to support complex, I/O‑dense designs.

With a supply voltage range of 1.14 V to 1.26 V, a 672‑ball BGA package, and an industrial operating temperature range of −40 °C to 100 °C, this device targets robust, space‑efficient implementations that require reliability across extended temperature ranges.

Key Features

• Logic Capacity — 34,000 logic elements to implement medium‑complexity digital functions and custom logic blocks.
• Embedded Memory — Approximately 2.15 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage without external memory dependence.
• High I/O Density — 410 I/O pins to support multiple parallel interfaces, sensor arrays, and wide bus connections.
• Power — Low-voltage core operation with a supply range of 1.14 V to 1.26 V to match modern low‑voltage system designs.
• Package and Mounting — 672‑BBGA (672‑FPBGA 27×27) surface‑mount package for compact board layouts and reliable solder connections.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet demanding environmental conditions.
• Compliance — RoHS‑compliant to support lead‑free assembly processes.

Typical Applications

• Industrial Control and Automation — Reconfigurable logic and high I/O count enable motor control, PLC front‑ends, and complex sensor interfacing across extended temperature ranges.
• Communications and Networking — On‑chip memory and abundant I/O support packet buffering, protocol bridging, and I/O aggregation tasks.
• Embedded System Integration — Use as a customizable logic hub for system glue, peripheral bridging, and tailored timing/control logic in compact form factors.

Unique Advantages

• Substantial Logic Density: 34,000 logic elements provide room for sophisticated custom logic and state machines without immediate need for larger FPGAs.
• On‑Chip Memory: Approximately 2.15 Mbits of embedded RAM reduces dependence on external memory, simplifying BOM and board routing.
• Extensive I/O: 410 I/O pins accommodate multiple parallel interfaces and high channel counts for I/O‑intensive applications.
• Industrial‑Grade Thermal Capability: −40 °C to 100 °C operating range supports deployment in harsh or temperature‑variable environments.
• Compact Ball Grid Package: 672‑BBGA (27×27) enables dense PCB layouts while preserving robust solder connections for surface‑mount assembly.
• RoHS Compliant: Supports lead‑free manufacturing and regulatory requirements for many industrial products.

Why Choose LFE2M35SE-6F672I?

The LFE2M35SE-6F672I offers a balanced combination of logic capacity, embedded memory, and high I/O count in a compact 672‑ball BGA package, tailored for industrial applications that require reliable operation across a wide temperature range. Its low‑voltage core and on‑chip resources help simplify system design by reducing external component needs.

This device is well suited for engineers designing mid‑complexity, I/O‑dense systems—such as control units, protocol adapters, and embedded logic hubs—who need a rugged, reprogrammable platform with clear, verifiable specifications and RoHS compliance.

Request a quote or submit a sales inquiry to get pricing and lead‑time information for the LFE2M35SE-6F672I. Our team can provide availability details and support to help integrate this FPGA into your next design.