LFE2M35SE-6FN484C

The LFE2M35SE-6FN484C is an ECP2M family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, designed for commercial electronic applications. It combines a high logic element count with substantial embedded memory and a large I/O complement to address complex digital logic and I/O-driven designs.

Key architectural attributes include 34,000 logic elements, approximately 2.15 Mbits of on-chip RAM, and up to 303 I/O pins, all delivered in a 484-BBGA surface-mount package. The device operates at a core supply range of 1.14 V to 1.26 V and is specified for commercial temperature ranges (0 °C to 85 °C).

Key Features

• Logic Capacity  34,000 logic elements for implementing medium-to-high complexity digital functions and custom logic blocks.
• Embedded Memory  Approximately 2.15 Mbits of on-chip RAM to support buffering, state machines, and data-path requirements.
• I/O Density  303 general-purpose I/O pins to support high-pin-count interfacing, multi-channel I/O, and dense connectivity.
• Power  Core voltage range of 1.14 V to 1.26 V for system-level power planning and supply design.
• Package & Mounting  484-BBGA package (supplier device package 484-FPBGA, 23 × 23 mm) in a surface-mount format for compact board integration.
• Operating Range  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Regulatory Status  RoHS compliant, supporting regulatory-driven assembly and manufacturing processes.

Typical Applications

• Commercial Embedded Systems  Implement complex control logic and custom digital functions using the device's 34,000 logic elements and embedded RAM.
• I/O-Intensive Interfaces  Supports designs that require high pin counts for parallel interfaces, multi-channel I/O, or board-level bridging with up to 303 I/O.
• Data Buffering and State Machines  Approximately 2.15 Mbits of on-chip RAM enable local buffering, FIFOs, and storage for deterministic logic operations.

Unique Advantages

• High Logic Integration: 34,000 logic elements reduce the need for external glue logic and simplify system design.
• Significant On-Chip Memory: Approximately 2.15 Mbits of embedded RAM supports data-path and control-state requirements without immediate dependence on external memory.
• Large I/O Count: 303 I/O pins enable dense connectivity and flexible interfacing options for multi-signal applications.
• Compact Surface-Mount Package: 484-BBGA (23 × 23 mm) provides a high-pin-density footprint suitable for space-constrained PCBs.
• Commercial Temperature and RoHS Compliance: Specified 0 °C to 85 °C range and RoHS compliance align with commercial manufacturing and environmental requirements.
• Low-Voltage Operation: 1.14 V to 1.26 V core supply supports system power budgeting and modern low-voltage designs.

Why Choose LFE2M35SE-6FN484C?

The LFE2M35SE-6FN484C positions itself as a commercially graded, mid-to-high-capacity FPGA option for designers who need a balance of logic density, on-chip memory, and extensive I/O in a compact package. Its combination of 34,000 logic elements, roughly 2.15 Mbits of embedded RAM, and 303 I/O pins makes it well suited for commercial embedded designs that require integrated digital logic and significant interfacing capability.

Manufactured by Lattice Semiconductor Corporation and delivered in a 484-BBGA surface-mount package, this device is appropriate for customers targeting commercial-temperature systems where RoHS compliance and efficient board-level integration are required.

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