LFE2M35SE-6FN672C

The LFE2M35SE-6FN672C is a field programmable gate array (FPGA) from Lattice Semiconductor Corporation in a 672-ball BGA package. It provides a balance of logic density, on-chip memory and high I/O count for commercial electronic designs.

This device features 34,000 logic elements, approximately 2.15 Mbits of embedded RAM, and 410 I/O pins, supporting surface-mount integration and operation across a commercial temperature range with low-voltage core supply requirements.

Key Features

• Core Capacity — 34,000 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 2.15 Mbits of on-chip RAM for buffering, state storage and local data processing.
• I/O Density — 410 general-purpose I/O pins to support wide connectivity and high pin-count interfaces on a single device.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match low-voltage system designs.
• Package & Mounting — 672-BBGA package (supplier device package: 672-FPBGA (27×27)) optimized for surface-mount PCB assembly.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance — RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Embedded Control Systems — Implement custom control logic and state machines using the device's substantial logic element count and on-chip RAM.
• High-Density I/O Interfaces — Consolidate multiple board-level signals and interface functions on a single FPGA thanks to 410 available I/Os.
• Custom Data Processing — Use the embedded memory and logic capacity for local buffering, packet handling or preprocessing tasks.
• Prototyping and Evaluation — Evaluate custom digital designs that require a balance of logic resources and I/O in a compact BGA package.

Unique Advantages

• High Logic Capacity: 34,000 logic elements enable substantial custom logic integration without external gate arrays.
• Significant On-Chip Memory: Approximately 2.15 Mbits of embedded RAM reduces dependence on external memory for many applications.
• Extensive I/O Count: 410 I/Os simplify system-level integration by accommodating numerous interfaces and signals directly.
• Compact BGA Package: 672-BBGA (672-FPBGA (27×27)) provides high pin density in a space-efficient footprint for board-level designs.
• Low-Voltage Core: 1.14 V to 1.26 V supply range supports integration into modern low-voltage power domains.
• RoHS Compliant: Meets lead-free requirements for compliant manufacturing processes.

Why Choose LFE2M35SE-6FN672C?

The LFE2M35SE-6FN672C positions itself as a commercial-grade FPGA option that combines a substantial logic element count, embedded memory and a high I/O count in a compact 672-BBGA package. Its specifications are suited to designers who need on-chip resources for complex logic, local data buffering and broad interface support while maintaining low-voltage operation.

For engineering teams and procurement looking for a mid-range FPGA option from Lattice Semiconductor Corporation, this device offers a clear, verifiable set of capabilities—34,000 logic elements, ~2.15 Mbits RAM, 410 I/Os, surface-mount packaging and RoHS compliance—that support scalable and reliable board-level integration within commercial temperature limits.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE2M35SE-6FN672C.