LFE2M35SE-7F672C

The LFE2M35SE-7F672C is an ECP2M family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a combination of 34,000 logic elements, approximately 2.15 Mbits of embedded RAM, and up to 410 user I/O in a compact 672-ball BGA package.

Designed for commercial embedded designs, this device targets applications that require mid-density programmable logic, substantial on-chip memory, and a high I/O count while operating from a low core supply voltage.

Key Features

• Core Logic 34,000 logic elements for implementing combinational and sequential logic, state machines, and glue logic.
• Embedded Memory Approximately 2.15 Mbits of on-chip RAM to support buffering, packet handling, and memory-intensive logic functions.
• I/O Density Up to 410 general-purpose I/O pins to support multi-channel interfaces and high-pin-count connectivity.
• Power Supply Core voltage range of 1.14 V to 1.26 V for low-voltage FPGA core operation.
• Package and Mounting 672-ball BGA package (supplier device package: 672-FPBGA, 27×27) with surface-mount mounting for compact board-level integration.
• Operating Range Commercial grade operation from 0 °C to 85 °C.
• Regulatory RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implements mid-density logic and custom control functions where up to 34,000 logic elements and 410 I/O are required.
• Memory-Intensive Logic — Uses approximately 2.15 Mbits of on-chip RAM for buffering, packet processing, and local data storage needs.
• High-Density I/O Interfaces — Supports multi-channel sensor arrays, parallel busses, and interface bridging with its high I/O count.

Unique Advantages

• Balanced Logic and Memory — 34,000 logic elements paired with ~2.15 Mbits of embedded RAM deliver capacity for both control logic and data buffering without external memory in many designs.
• High I/O Capability — Up to 410 I/O pins simplify connectivity for multi-channel and parallel-interface designs, reducing the need for external I/O expanders.
• Compact Board-Level Integration — 672-ball BGA (672-FPBGA, 27×27) surface-mount package minimizes PCB footprint while supporting high pin counts.
• Low-Voltage Core — 1.14 V to 1.26 V supply range supports low-power core operation where applicable to the design.
• Commercial Grade Reliability — Rated for 0 °C to 85 °C operation and RoHS compliant for commercial product deployments.

Why Choose LFE2M35SE-7F672C?

The LFE2M35SE-7F672C positions itself as a practical choice for commercial embedded designs that require a mid-density FPGA with substantial on-chip memory and a high number of I/O. Its combination of 34,000 logic elements, approximately 2.15 Mbits of RAM, and 410 I/O in a 672-ball BGA package delivers a compact, integrated solution for modern boards.

As a member of the ECP2M family from Lattice Semiconductor Corporation, this device offers designers a scalable option for projects that need a balance of logic capacity, embedded memory, and I/O without increasing PCB area or external component count.

Request a quote or submit an inquiry for pricing and availability of the LFE2M35SE-7F672C to evaluate fit for your next commercial FPGA design.