LFE2M35SE-7FN672C

IC FPGA 410 I/O 672FPBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 410 2151424 34000 672-BBGA

Quantity 802 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O410Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4250Number of Logic Elements/Cells34000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2151424

Overview of LFE2M35SE-7FN672C – ECP2M Field Programmable Gate Array (FPGA) IC, 672-BBGA

The LFE2M35SE-7FN672C is an ECP2M family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a mid-range logic capacity with a high I/O count in a compact ball-grid array package, suited for commercial-grade embedded designs.

With 34,000 logic elements, approximately 2.15 Mbits of on-chip memory and 410 available I/O, this device targets designs that require a balance of integration and I/O density while operating from a low-voltage supply.

Key Features

  • Core / Logic 34,000 logic elements for implementing medium-complexity programmable logic and custom functions.
  • Memory Approximately 2.15 Mbits of embedded memory to support on-chip data buffering and state storage.
  • I/O 410 general-purpose I/O pins to accommodate wide interfacing needs and parallel connections.
  • Power Supported supply voltage range from 1.14 V to 1.26 V for low-voltage system designs.
  • Package & Mounting 672-BBGA footprint (supplier package: 672-FPBGA, 27×27 mm), surface-mount package for compact board integration.
  • Temperature & Grade Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
  • Regulatory RoHS compliant for environmental and lead-free manufacturing requirements.

Unique Advantages

  • High logic capacity: 34,000 logic elements enable implementation of substantial custom logic without external programmable devices.
  • Significant on-chip memory: Approximately 2.15 Mbits of embedded RAM reduce dependence on external memory for many buffering and state-storage needs.
  • Extensive I/O availability: 410 I/O pins provide flexibility for interfacing sensors, peripherals, and parallel buses.
  • Compact, board-friendly package: 672-FPBGA (27×27 mm) surface-mount package balances density and routability for space-constrained designs.
  • Low-voltage operation: Narrow supply range (1.14 V–1.26 V) supports low-power system architectures and predictable power budgeting.
  • Commercial-grade and compliant: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream electronic products.

Why Choose LFE2M35SE-7FN672C?

The LFE2M35SE-7FN672C positions itself as a practical choice for commercial embedded designs that require a blend of mid-range programmable logic, on-chip memory, and a high number of I/O. Its compact 672-BBGA package and surface-mount mounting make it suitable for space-conscious PCBs where integration and I/O density are priorities.

Backed by Lattice Semiconductor Corporation, this ECP2M FPGA offers a clear, specification-driven option for engineers and procurement teams seeking a RoHS-compliant device with defined operating temperature and low-voltage supply requirements.

Request a quote or submit an inquiry to receive pricing and availability information for the LFE2M35SE-7FN672C.

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