LFE2M35SE-7FN256C

The LFE2M35SE-7FN256C is a member of the Lattice ECP2M family of field-programmable gate arrays (FPGAs). This device combines a high logic element count with on-chip embedded memory and a wide I/O complement to support complex system integration in commercial embedded applications.

Targeted for communications, signal processing and custom logic implementations, the device offers 34,000 logic elements (4,250 CLBs), approximately 2.15 Mbits of embedded memory, and 140 I/Os in a compact 256-ball fpBGA (17×17 mm) surface-mount package. The device operates from a core supply of 1.14–1.26 V and is specified for 0 °C to 85 °C operation. RoHS compliance is provided.

Key Features

• Logic Capacity 34,000 logic elements implemented across 4,250 CLBs to support mid-density FPGA designs.
• Embedded Memory Approximately 2.15 Mbits of on-chip RAM (total RAM bits: 2,151,424) for buffering, FIFOs and local storage.
• I/O and Package 140 user I/Os in a 256-ball fpBGA (256-FPBGA, 17×17 mm) surface-mount package for dense board-level integration.
• Power Supply Core voltage range 1.14 V to 1.26 V to match low-voltage system environments.
• Operating Conditions Commercial-grade device rated for 0 °C to 85 °C operation and RoHS compliant.
• Family-Level Enhancements As part of the Lattice ECP2/M family, the device is designed alongside features such as embedded SERDES (family-level), sysDSP blocks and flexible on-chip memory architectures described in the LatticeECP2/M datasheet.
• Surface Mount Standard surface-mount mounting type for automated PCB assembly.

Typical Applications

• Networking & Communications Use in mid-range communication interfaces where on-chip logic density and I/O count support protocol handling and data path implementation.
• Signal Processing Local buffering and DSP acceleration using embedded RAM and logic resources for tasks such as filtering and packet processing.
• Custom Control & Glue Logic Replacement of CPLDs and discrete logic with a single programmable device to reduce board-level component count.
• Embedded Systems Integration in commercial embedded products requiring configurable logic, on-chip memory and flexible I/O routing in a compact package.

Unique Advantages

• High Logic Density: 34,000 logic elements provide the capacity to implement complex state machines, data paths and control logic in a single device.
• Significant On-Chip Memory: Approximately 2.15 Mbits of embedded RAM reduces external memory dependence for buffering and local storage.
• Generous I/O Count: 140 I/Os enable broad peripheral interfacing and parallel connectivity without additional expansion chips.
• Compact, Assembly-Friendly Package: 256-ball fpBGA (17×17 mm) offers a small PCB footprint with surface-mount compatibility for volume manufacturing.
• Commercial Temperature Rating & RoHS Compliance: Suited for a wide range of commercial applications with environmental compliance for global markets.
• Family Ecosystem: Alignment with Lattice ECP2/M family features—such as SERDES, sysDSP and flexible memory blocks—supports portable designs across related devices.

Why Choose LFE2M35SE-7FN256C?

The LFE2M35SE-7FN256C provides a balanced combination of logic capacity, embedded memory and I/O in a compact fpBGA package, making it well suited for commercial embedded systems, communications endpoints and mid-range signal processing tasks. Its supply voltage range and commercial temperature rating align with common board-level power and thermal environments.

Designers looking for a platform that maps to the Lattice ECP2/M family can leverage family-level architectural features while using this device’s specific resources—34,000 logic elements, approximately 2.15 Mbits of on-chip RAM and 140 I/Os—to streamline system integration and reduce external components.

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