LFE2M35SE-7F256C

The LFE2M35SE-7F256C is a Lattice Semiconductor ECP2M family Field Programmable Gate Array (FPGA) supplied in a 256-ball fpBGA (17 × 17 mm) package. The device integrates approximately 34,000 logic elements and roughly 2.15 Mbits of embedded memory with 140 user I/Os, delivering a compact programmable fabric for communications, industrial and embedded system designs.

Built on the LatticeECP2/M architecture, this device targets applications requiring a balance of logic density, on-chip memory and flexible I/O, while operating within a commercial temperature range and a low-voltage core supply.

Key Features

• Logic Capacity  Approximately 34,000 logic elements for implementing medium-complexity RTL, glue logic and protocol processing.
• Embedded Memory  Total on-chip RAM of 2,151,424 bits (approximately 2.15 Mbits) to support buffers, FIFOs and local storage.
• I/O Count and Flexibility  140 user I/Os in a 256‑BGA package, supporting a wide range of external interfaces and board-level connectivity.
• Package and Mounting  256‑FPBGA (17 × 17 mm) surface-mount package for compact PCB integration.
• Low-Voltage Core Supply  Core supply specified from 1.14 V to 1.26 V to match system power budgets.
• Commercial Temperature Grade  Specified operating range from 0 °C to 85 °C for general-purpose commercial applications.
• LatticeECP2/M Family Capabilities  Family-level features include embedded high-performance DSP resources (sysDSP), flexible embedded block RAM (sysMEM), on-chip PLLs/DLLs for clock management, and optional high-speed SERDES (LatticeECP2M devices).
• Regulatory  RoHS compliant for environmental and manufacturing compliance.

Typical Applications

• High‑speed communications  Implement protocol bridging, packet processing or SERDES-based links supported by the LatticeECP2M family.
• Embedded networking equipment  Use on-chip memory and logic to implement buffering, frame handling and interface management in compact network devices.
• Industrial control and automation  Implement custom I/O aggregation, sensor interfacing and control logic within the commercial temperature range.
• Data path and DSP acceleration  Leverage family sysDSP blocks and embedded RAM for arithmetic, filtering and signal-processing tasks.

Unique Advantages

• Balanced integration: Combines roughly 34,000 logic elements with approximately 2.15 Mbits of embedded memory to consolidate multiple functions in a single device and reduce PCB BOM.
• Flexible I/O in a compact package: 140 I/Os in a 17 × 17 mm 256‑FPBGA enable dense I/O implementations in space-constrained designs.
• Low-voltage core operation: 1.14 V–1.26 V core supply supports modern power architectures and helps manage system power consumption.
• Family-level high-speed options: As part of the LatticeECP2/M family, the device benefits from family capabilities such as sysDSP, embedded block RAM, PLL/DLL clocking and optional high-speed SERDES for scalable system designs.
• Commercial-grade reliability: Specified 0 °C to 85 °C operating range for robust performance in standard commercial environments.
• RoHS compliance: Meets common environmental manufacturing requirements for lead‑free production.

Why Choose LFE2M35SE-7F256C?

The LFE2M35SE-7F256C provides a balanced FPGA solution for designers who need mid-range logic capacity, significant on-chip RAM and flexible I/O in a compact fpBGA footprint. Its positioning within the LatticeECP2/M family brings access to family-level DSP, memory and clocking resources that simplify implementation of communication, DSP and embedded control functions.

This device is well suited for teams developing compact, power-conscious systems requiring programmable logic, moderate embedded memory and a high I/O count—offering an efficient platform for prototype-through-production designs supported by Lattice’s ECP2/M feature set.

Request a quote or submit an inquiry to begin your evaluation and receive pricing and availability for the LFE2M35SE-7F256C.