LFE2M50E-5F484C

The LFE2M50E-5F484C is an ECP2M family field programmable gate array (FPGA) optimized for high-density system integration. It combines 48,000 logic elements with approximately 4.25 Mbits of on-chip memory and 270 I/Os in a 484-ball BGA package to support complex embedded designs.

Designed for applications that demand a mix of programmable logic, embedded memory and flexible I/O, this commercial-grade, surface-mount device delivers a compact platform for communications, DSP and interface bridging tasks while operating from a 1.14 V to 1.26 V supply.

Key Features

• Logic Fabric — 48,000 logic elements provide substantial capacity for combinational and sequential logic integration in a single device.
• Embedded Memory — Total on-chip RAM of 4,246,528 bits (approximately 4.25 Mbits) supports large buffers, FIFOs and scratch memory for data processing and packet handling.
• I/O and Package — 270 I/Os in a 484-ball BBGA (supplier package: 484-FPBGA, 23 × 23 mm) enable dense external connectivity while supporting surface-mount assembly.
• High-speed Serial & Protocol Support (family capability) — The ECP2M family includes embedded SERDES with data rates up to 3.125 Gbps and support for protocols such as PCI Express, Ethernet (1GbE, SGMII), OBSAI, CPRI and Serial RapidIO.
• DSP and Arithmetic Acceleration (family capability) — sysDSP blocks in the family provide dedicated multiply–accumulate resources suitable for signal processing and high-throughput arithmetic tasks.
• Clocking — On-chip PLLs and DLLs available in the family provide flexible clock multiplication, division and phase/delay adjustment for system timing needs.
• Power and Temperature — Narrow core supply range of 1.14 V to 1.26 V and commercial operating temperature from 0 °C to 85 °C.
• Regulatory — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-speed Communications — Implement protocol handling and PHY-level interfaces for PCI Express, 1GbE/SGMII, OBSAI and CPRI using the family’s SERDES and PCS capabilities.
• Signal Processing — Use embedded sysDSP blocks and abundant on-chip memory for real-time filtering, aggregation and packet processing tasks.
• Memory Interfaces and Bridging — Leverage the device’s embedded RAM and dedicated DDR/DDR2 support (family capability) for memory controller, buffering and bridge implementations.
• Custom I/O Aggregation — 270 programmable I/Os in a compact 484-BBGA package enable aggregation and protocol conversion for dense sensor or peripheral interfaces.

Unique Advantages

• High integration density: 48,000 logic elements and ~4.25 Mbits of embedded memory reduce the need for external logic and RAM, simplifying BOM and board complexity.
• Flexible, high-speed I/O: 270 I/Os in a 23 × 23 mm BGA footprint provide extensive external connectivity in a compact form factor.
• Family-level serial protocol support: ECP2M family SERDES support (up to 3.125 Gbps) enables direct implementation of industry-standard high-speed links.
• Designed for system-level timing: Integrated PLLs/DLLs provide adjustable clocking to align multi-clock domain designs and source-synchronous interfaces.
• Compliance-ready: RoHS compliance supports environmentally conscious manufacturing and supply chains.

Why Choose LFE2M50E-5F484C?

This FPGA balances substantial logic capacity, on-chip memory and a high I/O count in a compact 484-ball BGA package, making it well suited for communications, DSP and interface-focused embedded designs. Its family-level features — including high-speed SERDES, sysDSP blocks and flexible clocking — provide a solid platform for integrating protocol engines, memory interfaces and signal processing functions.

For teams building mid-to-high density programmable systems, the LFE2M50E-5F484C offers a combination of performance, integration and supplier-backed datasheet support to help accelerate development and reduce system-level component count.

Request a quote or contact sales to discuss availability, pricing and lead time for the LFE2M50E-5F484C.