LFE2M50E-5F900C

The LFE2M50E-5F900C is an ECP2M family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers high logic capacity and on-chip memory in a high-pin-count 900-ball BGA package, targeted at commercial-grade designs.

With 48,000 logic elements, approximately 4.25 Mbits of embedded RAM, and up to 410 I/O signals, this device is suited for designs that require substantial programmable logic, significant embedded memory, and large I/O capability while operating within a 1.14–1.26 V supply range and 0 °C to 85 °C temperature window.

Key Features

• Logic Capacity — 48,000 logic elements provide broad resource availability for complex digital designs and programmable logic implementations.
• Embedded Memory — Approximately 4.25 Mbits of on-chip RAM to support state storage, buffering, and data manipulation without external memory.
• High I/O Count — Up to 410 I/O pins to accommodate extensive peripheral, sensor, or bus connections in high-density systems.
• Package and Mounting — 900-ball BBGA package (supplier package: 900-FPBGA, 31 × 31 mm) with surface-mount mounting for compact, high-pin-count board designs.
• Power — Supported core voltage range of 1.14 V to 1.26 V for low-voltage system integration.
• Commercial Grade and Temperature Range — Commercial-grade device specified for operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant, supporting regulatory requirements for lead-free manufacturing.

Typical Applications

• Complex Digital Systems — Implement high-density logic functions and custom control logic using the device’s 48,000 logic elements and substantial embedded RAM.
• High I/O Interfaces — Support systems that require many external connections, such as multi-channel I/O hubs or interface concentrators, leveraging up to 410 I/O pins.
• Embedded Processing and Buffering — Use the on-chip memory for local buffering, state machines, and mid-sized data storage without relying exclusively on external memory.

Unique Advantages

• High Logic Density: 48,000 logic elements enable implementation of sizable programmable designs within a single device.
• Significant On-Chip Memory: Approximately 4.25 Mbits of embedded RAM reduce dependency on external memory and simplify board-level design.
• Extensive Connectivity: Up to 410 I/O pins allow integration with numerous peripherals and high-channel-count systems.
• Compact High-Pin-Count Package: 900-BBGA (31 × 31 mm) provides a space-efficient form factor for high-density PCB layouts.
• Low-Voltage Operation: 1.14–1.26 V supply range supports modern low-voltage system architectures.
• Commercial-Grade Compliance: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic products.

Why Choose LFE2M50E-5F900C?

The LFE2M50E-5F900C balances high logic capacity, substantial embedded memory, and a large I/O complement in a compact 900-ball BGA package from Lattice Semiconductor Corporation. Its commercial-grade temperature range and RoHS compliance make it suitable for mainstream electronic products that require programmable logic with significant on-chip resources.

This device is well suited to designers and teams building complex digital systems, high-I/O interface modules, or embedded applications that benefit from integrating logic and memory on a single FPGA to reduce board-level complexity and streamline system architecture.

Request a quote or submit an inquiry to purchase the LFE2M50E-5F900C and evaluate how its logic capacity, embedded memory, and I/O capabilities can meet your design requirements.