LFE2M50E-5FN672C

The LFE2M50E-5FN672C is a commercial-grade FPGA in the Lattice ECP2/M family that combines high logic capacity with substantial on‑chip memory and flexible I/O in a compact 672-ball BGA package. It targets system-level integration tasks where dense logic, many I/Os and embedded memory are required for networking, communications and high‑performance embedded applications.

Key device characteristics include approximately 48,000 logic elements, roughly 4.247 Mbits of embedded RAM, 372 user I/Os and a 672‑ball fpBGA (27×27 mm) package, with a nominal supply range of 1.14 V to 1.26 V and commercial operating temperature from 0 °C to 85 °C.

Key Features

• Logic Capacity — Approximately 48,000 logic elements providing significant gate density for complex glue logic, protocol bridging and control functions.
• Embedded Memory — Approximately 4.247 Mbits of on‑chip RAM to support buffering, packet processing and embedded data storage without external SRAM for many functions.
• High I/O Count — 372 user I/Os to support multi‑lane interfaces, bus bridges and large peripheral sets in a single device.
• Package & Mounting — 672‑ball fpBGA package (27×27 mm), surface‑mount, suited for compact board layouts where high I/O density is required.
• Power & Temperature — Core supply range 1.14 V to 1.26 V and commercial operating range 0 °C to 85 °C for standard application environments.
• Family-Level System Features — As a member of the LatticeECP2/M family, the device benefits from family-level capabilities such as embedded DSP resources, configurable PLLs/DLLs, pre‑engineered source‑synchronous I/O support and high‑speed SERDES on ECP2M variants.
• Configuration & Reliability — Family configuration features include SPI boot flash interface, dual‑boot image support and embedded features for system debugging and configuration management.
• Compliance — RoHS‑compliant commercial‑grade device packaging and materials.

Typical Applications

• Telecommunications & Networking — Implement multi‑protocol logic, packet buffering and interface bridging where high I/O count and on‑chip memory reduce external components.
• High‑Speed Serial Interfaces — Use family SERDES and source‑synchronous I/O support (where applicable) for protocol endpoints and chip‑to‑chip links.
• Data Acquisition & Signal Processing — On‑chip RAM and DSP resources in the ECP2/M family support front‑end buffering and algorithm acceleration.
• Embedded System Integration — Consolidate glue logic, peripheral control and custom finite‑state machines into a single FPGA to simplify board design and reduce BOM.

Unique Advantages

• High Logic Density: Roughly 48,000 logic elements enable complex system functions without resorting to multiple discrete devices.
• Substantial On‑Chip Memory: Approximately 4.247 Mbits of embedded RAM reduce dependency on external memory for many buffering and temporary storage needs.
• Large I/O Count in a Compact Package: 372 I/Os in a 672‑ball fpBGA (27×27 mm) package provide high connectivity while preserving PCB real estate.
• Commercial‑Grade Reliability: Designed for standard commercial temperature ranges and RoHS compliance for broad market compatibility.
• System-Level Feature Set: Family features such as configurable PLLs/DLLs, DSP blocks and SERDES (ECP2M family) enable integrated timing, processing and high‑speed interface designs.

Why Choose LFE2M50E-5FN672C?

This device is positioned for designers who need a high‑capacity, commercially graded FPGA with a large I/O complement and meaningful on‑chip RAM to consolidate functions and simplify board-level designs. It is well suited to communications, embedded processing and system integration roles where the combination of logic density, memory and I/O density delivers tangible BOM and layout advantages.

Choosing this FPGA gives access to the Lattice ECP2/M family feature set—enabling DSP acceleration, flexible clocking and high‑speed interface support while keeping power and board complexity under control. The compact 672‑ball package and defined commercial temperature and voltage ranges make it practical for mainstream embedded applications.

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