LFE2M50E-5FN484I

The LFE2M50E-5FN484I is an ECP2M field programmable gate array (FPGA) IC designed for industrial applications. It integrates a high count of logic elements, substantial embedded RAM, and extensive I/O in a compact 484-ball BGA footprint.

This device is suited to designs that require significant on-chip logic and memory resources while operating across an industrial temperature range and a low core voltage rail, enabling dense integration and reliable operation in demanding environments.

Key Features

• Core Logic 48,000 logic elements provide a flexible fabric for implementing custom digital functions and system glue logic.
• Embedded Memory Approximately 4.25 Mbits of total on-chip RAM for buffering, FIFOs, and state storage.
• I/O Capacity 270 user I/O pins to support broad connectivity and peripheral interfacing without external expanders.
• Power Operates from a core supply voltage between 1.14 V and 1.26 V, enabling predictable power budgeting for the core domain.
• Package 484-ball BGA package (supplier device package: 484-FPBGA, 23×23) for a compact, solderable surface-mount solution.
• Temperature Range & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in extended-temperature environments.
• Mounting & Compliance Surface-mount package and RoHS-compliant construction to meet modern assembly and environmental requirements.

Typical Applications

• Industrial Control — Implement motor control logic, protocol bridging, and real-time sequencing using the device’s abundant logic elements and I/O count while maintaining operation across industrial temperatures.
• Communications & Infrastructure — Use on-chip memory and dense I/O for packet buffering, protocol handling, and interface aggregation in network equipment.
• Embedded Systems & Prototyping — Rapidly implement custom processors, accelerators, or system glue for embedded products that require significant on-chip logic and memory resources.

Unique Advantages

• High Logic Density: 48,000 logic elements enable complex designs and integration of multiple functions into a single device, reducing external component count.
• Substantial On-Chip Memory: Approximately 4.25 Mbits of embedded RAM supports buffering and state retention without relying on external memory parts.
• Extensive I/O Count: 270 I/O pins provide flexibility to connect sensors, interfaces, and peripherals directly to the FPGA fabric.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in harsh or varied ambient conditions.
• Compact BGA Package: 484-ball FPBGA (23×23) offers a space-efficient package suitable for dense board layouts.
• RoHS Compliant: Environmentally compliant manufacturing supports modern assembly and regulatory requirements.

Why Choose LFE2M50E-5FN484I?

The LFE2M50E-5FN484I positions itself as a highly integrated FPGA option for industrial designs that need a balance of logic density, embedded memory, and extensive I/O in a compact package. Its operating voltage and temperature range make it suitable for robust embedded systems and infrastructure equipment.

Designers and procurement teams seeking a field-programmable device that consolidates functionality, reduces board-level BOM, and supports deployment across extended temperatures will find this FPGA aligned with medium- to high-complexity digital implementations.

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