LFE2M50E-5FN900I

The LFE2M50E-5FN900I is an ECP2M family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a high-density combination of logic resources, embedded memory and I/O capacity in a compact ball-grid array package.

With 48,000 logic elements, approximately 4.25 Mbits of on-chip RAM and 410 I/O pins, this industrial-grade device supports complex digital implementations within a 900-ball BGA footprint and operates over a wide supply and temperature range.

Key Features

• Core Logic  48,000 logic elements provide a large fabric for implementing complex digital functions and custom logic.
• Embedded Memory  Approximately 4.25 Mbits of total on-chip RAM to support data buffering, state machines and memory-intensive logic blocks.
• I/O Capacity  410 available I/O pins to support high channel counts and wide parallel interfaces.
• Package & Mounting  900-ball FBGA package (900-BBGA / 900-FPBGA, 31 × 31) in a surface-mount form factor for dense PCB integration.
• Power  Nominal supply range from 1.14 V to 1.26 V to match system power rails and support power planning.
• Temperature & Grade  Industrial grade operation with an operating temperature range of −40 °C to 100 °C for use in temperature-demanding environments.
• Compliance  RoHS compliant, meeting common restrictions on hazardous substances for regulatory and manufacturing requirements.

Typical Applications

• Industrial Systems  Industrial-grade temperature range and robust I/O count make this FPGA suitable for control and automation applications that require reliable operation across −40 °C to 100 °C.
• High-density Logic Implementations  Large logic capacity (48,000 logic elements) and substantial on-chip RAM enable complex state machines, protocol processing and custom datapaths.
• I/O-intensive Designs  With 410 I/O pins, the device supports wide parallel interfaces, multi-channel sensor aggregation or multiport connectivity in compact designs.
• Embedded System Integration  Surface-mount 900-ball BGA and modest supply voltage range simplify integration into space-constrained embedded PCBs that require significant programmable logic.

Unique Advantages

• High integration of logic and memory: 48,000 logic elements paired with approximately 4.25 Mbits of embedded RAM reduce external memory needs and simplify board-level design.
• Extensive I/O capability: 410 I/O pins allow flexible interfacing to multiple peripherals, sensors and buses without external expanders.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in harsh or wide-range thermal environments.
• Compact BGA footprint: 900-ball FPBGA (31 × 31) enables dense PCB layouts while maintaining high pin count and signal density.
• Controlled supply range: 1.14 V to 1.26 V supply simplifies power budgeting and integration with modern low-voltage systems.
• RoHS compliant: Meets common environmental and manufacturing requirements for hazardous substance restrictions.

Why Choose LFE2M50E-5FN900I?

The LFE2M50E-5FN900I delivers a balanced mix of logic density, on-chip memory and high I/O count in an industrial-grade FPGA package. Its 48,000 logic elements and approximately 4.25 Mbits of embedded RAM support large, memory-aware designs while the 410 I/Os and compact 900-ball BGA make it suitable for space-constrained boards that require substantial connectivity.

Manufactured by Lattice Semiconductor Corporation, this device is well-suited for engineers and procurement teams seeking a robust FPGA solution that combines integration, predictable power requirements and industrial temperature operation for long-term deployment.

Request a quote or submit a product inquiry for the LFE2M50E-5FN900I by providing the part number and your quantity requirements to start the procurement process.