LFE2M50E-6F672I

The LFE2M50E-6F672I is a field programmable gate array (FPGA) from Lattice Semiconductor designed for industrial-grade embedded applications. It delivers a balance of logic capacity, on-chip memory, and I/O density in a compact 672-ball BGA package.

With 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and 372 I/Os, this device supports complex glue-logic, protocol bridging, and control-system integration while operating across a wide industrial temperature range.

Key Features

• Core Logic — 48,000 logic elements to implement custom digital logic, state machines, and glue functions.
• Embedded Memory — Approximately 4.25 Mbits of on-chip RAM for FIFOs, buffering, and local data storage.
• I/O Capacity — 372 general-purpose I/Os to support multiple external interfaces and parallel connections.
• Power — Voltage supply range from 1.14 V to 1.26 V for core power compatibility within specified system rails.
• Package and Mounting — Surface-mount 672-ball BGA (supplier device package: 672-FPBGA, 27×27) for compact, high-density board designs.
• Industrial Temperature Grade — Rated for operation from −40°C to 100°C to meet industrial environmental requirements.
• RoHS Compliant — Conforms to RoHS environmental directives for lead-free assembly.

Typical Applications

• Industrial Control and Automation — Implements custom logic and interface bridging in systems requiring industrial temperature operation and robust I/O.
• Embedded System Glue Logic — Replaces discrete logic for protocol conversion, bus arbitration, and timing control using abundant logic elements and on-chip RAM.
• High-Density I/O Designs — Enables boards that require many external connections with 372 available I/Os.

Unique Advantages

• Substantial Logic Capacity: 48,000 logic elements allow implementation of complex state machines and custom processing pipelines.
• Significant On-Chip Memory: Approximately 4.25 Mbits of embedded RAM reduces dependency on external memory for buffering and local storage.
• Extensive I/O Count: 372 I/Os simplify board-level routing by accommodating multiple interfaces without external expanders.
• Industrial Temperature Range: Specified operation from −40°C to 100°C supports deployment in demanding environments.
• Compact BGA Package: 672-ball BGA (672-FPBGA, 27×27) enables high-density board layouts while keeping the solution surface-mount.
• Regulatory Compliance: RoHS compliance facilitates lead-free manufacturing and regulatory alignment.

Why Choose LFE2M50E-6F672I?

The LFE2M50E-6F672I provides a balanced combination of logic capacity, embedded memory, and I/O resources in a surface-mount BGA package tailored for industrial applications. Its specified voltage range and industrial temperature rating make it suitable for designs that require stable operation across a wide set of environmental conditions.

This device is well suited to engineering teams designing mid- to high-complexity embedded systems that need on-chip RAM for buffering, a large number of I/Os for connectivity, and reliable operation over industrial temperature ranges. Its packaging and feature set support scalable designs and help reduce external component count.

Request a quote or submit an inquiry for pricing and availability of LFE2M50E-6F672I to begin integrating this FPGA into your next design.