LFE2M50E-6F672C

The LFE2M50E-6F672C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation's ECP2M family. It combines a high logic capacity and on-chip memory with extensive I/O in a 672-ball BGA package to support mid-range programmable logic applications.

With approximately 48,000 logic elements, roughly 4.25 Mbits of embedded RAM, and 372 I/O, this device targets I/O-dense and memory-intensive designs that require surface-mount packaging and commercial temperature operation.

Key Features

• Core Logic  Approximately 48,000 logic elements for implementing custom digital logic and control functions.
• Embedded Memory  Total on-chip RAM of 4,246,528 bits (approximately 4.25 Mbits) for buffering, lookup tables, and state storage.
• I/O Density  372 general-purpose I/O pins to support complex interfacing and multiple parallel connections.
• Power  Low-voltage operation with a nominal supply range of 1.14 V to 1.26 V.
• Package & Mounting  672-ball BGA package (supplier device package: 672-FPBGA (27x27)) designed for surface-mount assembly.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance  RoHS-compliant construction for regulatory and environmental considerations.

Typical Applications

• I/O-Intensive Interfaces  Use the device's 372 I/O pins to implement protocol bridges, parallel interfaces, and complex connectivity hubs.
• Memory-Driven Logic  Leverage approximately 4.25 Mbits of embedded RAM for packet buffering, LUT-based processing, and intermediate data storage.
• Custom Control and Signal Processing  Deploy the 48,000 logic elements for application-specific control, combinational logic, and moderate-density signal processing tasks.

Unique Advantages

• High Logic Capacity: Approximately 48,000 logic elements enable substantial custom logic integration without external PLD components.
• Significant On-Chip Memory: About 4.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and LUT needs.
• Extensive I/O: 372 I/O pins simplify board-level routing for multi-channel and parallel interfaces.
• Compact BGA Package: The 672-ball BGA (672-FPBGA (27x27)) supports high-density PCB layouts while remaining surface-mount compatible.
• Low-Voltage Operation: Operation in the 1.14 V to 1.26 V range supports integration with low-voltage system rails.
• Commercial Temperature Range: Rated 0 °C to 85 °C for typical commercial applications and environments.

Why Choose LFE2M50E-6F672C?

The LFE2M50E-6F672C delivers a balanced combination of logic capacity, embedded memory, and I/O density in a single surface-mount BGA package, making it well suited for mid-range programmable logic designs that require on-chip RAM and extensive interfacing. As an ECP2M-family device from Lattice Semiconductor Corporation, it provides a practical option for designs operating within commercial temperature limits and low-voltage system environments.

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