LFE2M50E-6FN484C

The LFE2M50E-6FN484C is a commercial-grade FPGA from Lattice Semiconductor offering mid-range logic density and a high I/O count in a compact BGA package. It combines 6,000 CLBs and 48,000 logic elements with on-chip embedded memory and flexible I/O to support a variety of reconfigurable digital designs.

Designed for surface-mount deployment, this device operates from a 1.14 V to 1.26 V supply and across a 0 °C to 85 °C commercial temperature range, providing a balance of integration and power efficiency for mainstream electronic applications.

Key Features

• Core Logic  6,000 CLBs delivering 48,000 logic elements to implement complex combinational and sequential logic.
• Embedded Memory  Approximately 4.25 Mbits of on-chip RAM for buffering, state storage, and small-footprint data structures.
• I/O Capacity  270 user I/O pins to accommodate multiple interfaces, peripherals, and board-level connectivity.
• Power  Low-voltage operation with a supply range of 1.14 V to 1.26 V for the core logic.
• Package and Mounting  484-ball fine-pitch BGA (484-FPBGA, 23×23) in a surface-mount format for compact board integration.
• Temperature and Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance  RoHS-compliant construction for environmental regulation alignment.

Typical Applications

• Reconfigurable logic implementations  Use where mid-range logic capacity and on-chip RAM are required to implement custom digital functions.
• Multi-interface bridging  Ideal for designs that require a large number of I/Os (270) to connect multiple peripherals or bus interfaces.
• Embedded control and prototyping  Suitable for commercial embedded systems and development platforms that benefit from field-programmable logic and memory resources.

Unique Advantages

• High logic capacity: 48,000 logic elements and 6,000 CLBs provide the resources to implement substantial custom logic without moving to larger, more expensive devices.
• Substantial on-chip memory: Approximately 4.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Generous I/O count: 270 I/Os enable integration of multiple interfaces and peripherals on a single device, simplifying board-level design.
• Compact BGA package: 484-ball FPBGA (23×23) offers a space-efficient footprint for high-density board layouts.
• Low-voltage core: 1.14 V to 1.26 V supply range supports efficient power delivery and modern system architectures.
• RoHS compliant: Environmentally compliant manufacturing eases regulatory alignment in commercial products.

Why Choose LFE2M50E-6FN484C?

The LFE2M50E-6FN484C positions itself as a capable mid-range FPGA for commercial designs that require a balance of logic density, embedded memory, and high I/O count in a compact package. Its combination of 6,000 CLBs, approximately 4.25 Mbits of RAM, and 270 I/Os makes it suitable for projects that need substantial on-chip resources without stepping up to larger device families.

Procurement and design teams benefit from its surface-mount 484-ball FPBGA packaging and RoHS compliance, delivering a practical solution for commercial embedded systems and development platforms that demand flexible, reconfigurable logic with reliable operating conditions.

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