LFE2M50E-6FN672I

The LFE2M50E-6FN672I is an ECP2M field programmable gate array (FPGA) device offering a balance of programmable logic, on-chip memory, and high I/O density in a compact BGA package. With 48,000 logic elements and approximately 4.25 Mbits of embedded memory, the device supports designs that require substantial programmable resources and flexible I/O.

Designed for surface-mount integration and rated for industrial temperature operation, this FPGA is intended for applications where programmable logic, significant I/O counts, and controlled supply voltage are key design considerations.

Key Features

• FPGA Core  ECP2M field programmable gate array architecture providing on-chip programmable logic resources.
• Logic Capacity  48,000 logic elements to implement complex digital functions and custom processing pipelines.
• Embedded Memory  Approximately 4.25 Mbits of on-chip RAM for buffering, state storage, and data processing tasks.
• I/O Density  372 I/O pins to support multiple interfaces, peripherals, and parallel data paths.
• Power  Specified supply range from 1.14 V to 1.26 V for core operation.
• Packaging & Mounting  672-BBGA package (supplier device package: 672-FPBGA, 27 × 27 mm) for high pin count in a surface-mount form factor.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C and specified as industrial grade.
• Regulatory Compliance  RoHS compliant for environmental compatibility in compliant assemblies.

Typical Applications

• Industrial Control & Automation  Industrial temperature rating and high I/O count support motor control, PLC logic, and sensor interfacing in factory automation.
• Instrumentation & Test Equipment  Significant on-chip RAM and logic capacity enable real-time data capture, processing, and custom signal conditioning functions.
• High-Density Interface Bridging  Large I/O complement and programmable logic make the device suitable for bridging between multiple parallel and serial interfaces.

Unique Advantages

• Substantial Logic Resources: 48,000 logic elements provide the capacity to implement complex, customized digital systems without external logic expansion.
• Integrated On-Chip Memory: Approximately 4.25 Mbits of embedded RAM reduces reliance on external memory for buffering and local data storage.
• High I/O Count: 372 I/Os simplify integration of multiple peripherals and parallel data paths, lowering the need for external multiplexers.
• Industrial Reliability: Industrial-grade operating range (−40 °C to 100 °C) and RoHS compliance support deployment in rugged or regulated environments.
• Compact, High-Pin Package: 672-BBGA (672-FPBGA, 27 × 27 mm) delivers a high pin count in a space-efficient surface-mount footprint for dense board designs.

Why Choose LFE2M50E-6FN672I?

The LFE2M50E-6FN672I positions itself as a versatile FPGA choice for engineers who need a robust combination of programmable logic, embedded memory, and high I/O in an industrial-grade device. Its balanced specification set supports a wide range of custom digital functions while simplifying board-level integration through a single, compact package.

This part is well suited for designs that demand on-chip resources, predictable operating voltage, and extended temperature tolerance. Its specification profile offers long-term value through integration and scalability for evolving embedded and control applications.

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