LFE2M50E-6FN900I

The LFE2M50E-6FN900I is an industrial‑grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation built on the ECP2M family architecture. It delivers a balance of logic density, embedded memory and a high I/O count in a compact 900‑ball BGA package for space‑constrained, performance‑oriented designs.

With 48,000 logic elements and approximately 4.25 Mbits of on‑chip RAM, the device targets applications that require substantial programmable logic, significant buffering or working memory, and extensive external interfacing while operating across an industrial temperature range.

Key Features

• Core logic  48,000 logic elements provide substantial programmable capacity for glue logic, protocol processing, and custom datapaths.
• Embedded memory  Approximately 4.25 Mbits of on‑chip RAM support buffering, packet queues, and local data storage for high‑throughput designs.
• I/O capacity  410 general‑purpose I/Os enable wide external connectivity for multi‑channel interfaces, parallel buses, and high‑pincount peripherals.
• Power supply  Core voltage operation from 1.14 V to 1.26 V to match modern low‑voltage system rails.
• Package and mounting  900‑BBGA (900‑FPBGA, 31 × 31) surface‑mount package provides high pin density in a compact footprint for board space optimization.
• Temperature and grade  Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Environmental compliance  RoHS‑compliant construction to meet standard environmental and manufacturing requirements.

Typical Applications

• Industrial control  Implement motor control logic, sensor interfacing, and deterministic I/O aggregation using the device’s logic capacity and wide I/O available in an industrial‑temperature package.
• Communications and networking  Use embedded RAM for packet buffering and the high I/O count for multi‑lane interfaces, protocol bridging, and custom packet processing tasks.
• Test and measurement equipment  Leverage programmable logic and abundant I/O to implement data acquisition front ends, preprocessing, and interface translation in benchtop and rack systems.
• High‑density I/O subsystems  Deploy the 900‑BBGA package where compact, high‑pin‑count solutions are required for parallel bus handling and wide peripheral support.

Unique Advantages

• Substantial programmable capacity: 48,000 logic elements enable complex custom logic and multiple concurrent functions on a single device, reducing BOM count.
• Significant on‑chip memory: Approximately 4.25 Mbits of embedded RAM supports buffering and local data processing without relying solely on external memory.
• Very high I/O count: 410 I/Os accommodate numerous peripherals and parallel interfaces, simplifying board-level routing and interface consolidation.
• Industrial operating range: Rated from −40 °C to 100 °C for use in temperature‑sensitive industrial and ruggedized environments.
• Compact high‑pin package: The 900‑BBGA (31 × 31) package provides a dense pinout for high‑function designs while minimizing PCB area.
• Low‑voltage core compatibility: Core supply range of 1.14–1.26 V aligns with contemporary low‑voltage system architectures.

Why Choose LFE2M50E-6FN900I?

The LFE2M50E-6FN900I delivers a combination of logic density, on‑chip memory and extensive I/O in a compact 900‑ball BGA package, making it a practical choice for applications that need significant programmable resources without a large board footprint. Its industrial temperature rating and RoHS compliance make it suitable for deployment in demanding environments where reliability and regulatory alignment are required.

This FPGA is well suited to engineers and system designers building industrial controllers, communications equipment, test instruments and other high‑I/O systems that benefit from integrated memory and flexible logic. The device’s specified voltage, package and environmental ratings provide a clear basis for system selection and long‑term deployment planning.

Request a quote today to discuss pricing and availability for the LFE2M50E-6FN900I or to submit a purchase inquiry for this ECP2M family FPGA.