LFE2M50E-7F900C

The LFE2M50E-7F900C is an ECP2M family field programmable gate array (FPGA) offering a high density of programmable logic and on-chip memory in a compact ball-grid array package. It provides 48,000 logic elements and approximately 4.25 Mbits of embedded RAM, together with up to 410 I/O pins for high-pin-count applications.

Designed for commercial-grade designs, the device operates from a core voltage range of 1.14 V to 1.26 V and is specified for operation from 0 °C to 85 °C. The part is RoHS compliant and supplied in a surface-mount 900-BBGA (900-FPBGA, 31×31) package.

Key Features

• Logic Capacity  48,000 logic elements provide substantial programmable resources for implementing complex logic functions and custom processing pipelines.
• Configurable Logic Blocks  High block count enables partitioning of designs across programmable logic for modular implementations.
• Embedded Memory  Approximately 4.25 Mbits of on-chip RAM for buffering, look-up tables, and state storage without external memory dependency.
• High I/O Count  Up to 410 I/O pins support dense peripheral interfacing and multi-channel signal connectivity.
• Power Supply  Core voltage range of 1.14 V to 1.26 V to match system power domains and support low-voltage operation.
• Package and Mounting  Surface-mount 900-BBGA package (supplier package: 900-FPBGA, 31×31) for compact board-level integration.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for standard commercial electronic environments.
• RoHS Compliant  Meets RoHS environmental requirements for hazardous substance reduction.

Unique Advantages

• High logic density: 48,000 logic elements enable substantial on-chip functionality, reducing dependence on external processors or glue logic.
• Significant on-chip memory: Approximately 4.25 Mbits of embedded RAM supports buffering and local data storage for performance-sensitive tasks.
• Large I/O capability: 410 I/O pins allow direct interfacing to multiple peripherals and high-channel-count designs without external multiplexing.
• Compact, board-friendly package: 900-BBGA (31×31) provides a small footprint for high-density PCB layouts while maintaining high pin count.
• Commercial-grade operating range: Specified 0 °C to 85 °C operation and RoHS compliance align with standard commercial product requirements.
• Low-voltage core operation: 1.14 V to 1.26 V supply range supports integration into low-voltage systems and power-optimized designs.

Why Choose LFE2M50E-7F900C?

The LFE2M50E-7F900C is positioned for designs that require a balance of high logic capacity, substantial embedded memory, and extensive I/O in a compact surface-mount package. Its 48,000 logic elements and approximately 4.25 Mbits of RAM provide the resources needed to implement sophisticated digital functions while minimizing external components.

With a 900-BBGA footprint, RoHS compliance, and commercial temperature rating, this FPGA is well suited to long-life commercial applications that demand a high pin count and efficient board integration. It offers designers a measurable path to consolidate functionality, reduce BOM complexity, and maintain a compact form factor.

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