LFE2M50E-7FN484C

The LFE2M50E-7FN484C is a Lattice Semiconductor ECP2M family field programmable gate array (FPGA) in a 484-ball BGA package. It combines a high logic capacity fabric with substantial embedded memory and a large I/O complement for system-level integration.

Designed for commercial applications, this device targets designs that require advanced DSP and high-speed serial capabilities available across the ECP2M family while providing a compact 484-ball fpBGA (23 × 23 mm) form factor, RoHS compliance, and standard commercial operating range.

Key Features

• Logic Capacity — 48,000 logic elements suitable for complex glue logic, protocol handling, and mid-size FPGA designs.
• Embedded Memory — Approximately 4.25 Mbits of on-chip RAM (4,246,528 total RAM bits) to support frame buffers, FIFOs, and state storage.
• I/O Density — 270 user I/Os for dense peripheral interfacing and multi-channel connectivity.
• High-Speed SERDES (ECP2M family) — Family-level support for embedded SERDES with data rates from 250 Mbps to 3.125 Gbps and up to 16 channels per device, enabling serialized links for networking and chip-to-chip interfaces.
• sysDSP and DSP Resources (family) — ECP2M family includes dedicated sysDSP blocks for high-performance multiply/accumulate operations to accelerate signal processing tasks.
• Clocking and Timing — Family support for GPLLs and SPLLs plus DLLs for flexible clock management and dynamic PLL adjustment.
• Configuration and Security — Flexible configuration options in the family including SPI boot flash interface, dual boot images, and 1149.1 boundary-scan compliance; optional bitstream encryption is provided in ECP2M “S” versions (family-level feature).
• Package & Mounting — 484-ball fpBGA (484-FPBGA, 23 × 23 mm), surface-mount device for compact board integration.
• Supply & Temperature — Voltage supply range 1.14 V to 1.26 V; commercial operating temperature 0 °C to 85 °C.
• Environmental — RoHS compliant.

Typical Applications

• High-speed serial networking — Use embedded SERDES and the device's I/O density to implement serial links and protocol bridging for networking, telecom, and backplane interfaces.
• DSP and signal processing — Leverage sysDSP resources and on-chip RAM for real-time signal processing, filtering, and accumulation tasks in communications and instrumentation systems.
• Memory interfacing and buffering — Utilize the approximately 4.25 Mbits of embedded memory for frame buffering, packet queues, and latency management in data-path designs.
• Multi‑I/O control and protocol bridging — 270 I/Os allow consolidation of multiple peripheral interfaces and protocol translation in a single FPGA device.

Unique Advantages

• High logic density: 48,000 logic elements provide the capacity to implement complex control logic and mid-sized system functions on one device, reducing BOM count.
• Substantial on-chip RAM: Approximately 4.25 Mbits of embedded memory reduces reliance on external RAM for many buffering and state-storage needs.
• Extensive I/O: 270 user I/Os support broad peripheral and sensor connectivity without external multiplexing.
• Family-level high-speed SERDES: Enables serialized protocol links and high-bandwidth channels where required by the design.
• Compact BGA package: 484-ball fpBGA (23 × 23 mm) provides a high-pin-count solution in a compact surface-mount footprint for space-constrained boards.
• Commercial-grade operating range: 0 °C to 85 °C for designs targeting standard commercial environments.

Why Choose LFE2M50E-7FN484C?

The LFE2M50E-7FN484C positions itself as a versatile mid-to-high capacity FPGA within the Lattice ECP2M family, delivering a balance of logic density, embedded memory, and I/O resources in a compact 484-ball fpBGA package. Its family-level support for DSP blocks, flexible clocking, and high-speed SERDES makes it suitable for designs that need integrated signal processing and serialized connectivity without moving to larger device classes.

For design teams seeking an FPGA solution with verified family capabilities and compatibility with established Lattice tool flows, this device offers scalable functionality and integration that can simplify board-level design and accelerate system integration.

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