LFE2M50E-7FN900C

The LFE2M50E-7FN900C is an ECP2M-series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation supplied in a 900-ball BGA package. It delivers a substantial integration footprint with high logic density, embedded memory, and a large number of I/O pins for commercial embedded designs.

With 48,000 logic elements, approximately 4.25 Mbits of on-chip RAM, and 410 I/Os, this FPGA is targeted at designs that require extensive logic, memory and interfacing capability in a compact surface-mount package operating from a 1.14 V to 1.26 V core supply.

Key Features

• Core Logic 48,000 logic elements provide high-density programmable logic for complex combinational and sequential designs.
• Logic Blocks Approximately 6,000 logic blocks to organize and map hierarchical designs efficiently.
• Embedded Memory Approximately 4.25 Mbits (4,246,528 bits) of on-chip RAM for data buffering, state storage, and embedded memory structures.
• I/O Capacity 410 user I/O pins to support broad connectivity and multiple parallel interfaces without excessive external glue logic.
• Power Core supply range of 1.14 V to 1.26 V for alignment with low-voltage system rails.
• Package & Mounting 900-BBGA (supplier device package: 900-FPBGA 31×31) with surface-mount mounting for compact board-level integration.
• Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental RoHS-compliant for regulatory and environmental assurance.

Typical Applications

• Embedded processing and control — Use the device's 48,000 logic elements and on-chip RAM to implement custom controllers, datapaths, and state machines for embedded systems.
• I/O-rich interface systems — 410 I/Os enable integration of multiple parallel interfaces, sensor arrays, or board-level interconnects without heavy external logic.
• Data buffering and protocol bridging — Substantial embedded memory supports buffering, packet handling, and protocol adaptation within a single FPGA.
• Compact board-level integration — The 900-BBGA surface-mount package allows high-density designs where board space is at a premium.

Unique Advantages

• High logic density: 48,000 logic elements enable implementation of large-scale logic functions and complex state machines on a single device.
• Significant on-chip memory: Approximately 4.25 Mbits of embedded RAM reduces reliance on external memory and simplifies board design.
• Extensive I/O count: 410 I/Os expand system interfacing options and can reduce the need for additional I/O expanders.
• Compact, standardized package: 900-FPBGA (31×31) BGA provides a compact, solderable footprint for dense PCB layouts.
• Low-voltage core operation: 1.14 V–1.26 V supply range fits modern low-voltage system architectures.
• Commercial readiness: RoHS compliance and a 0 °C to 85 °C operating range align the device with mainstream commercial product requirements.

Why Choose LFE2M50E-7FN900C?

The LFE2M50E-7FN900C combines high logic capacity, sizable embedded memory, and a large I/O count in a compact 900-BBGA surface-mount package from Lattice Semiconductor. Its specifications target commercial embedded designs that require substantial integration of logic, memory, and interfaces while maintaining a small board footprint and a low-voltage core supply.

This device is well suited for engineers and procurement teams seeking a commercially graded FPGA option that balances density, on-chip memory, and connectivity for scalable, I/O-intensive applications.

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