LFE2M50SE-5F672I

IC FPGA 372 I/O 672FPBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 372 4246528 48000 672-BBGA

Quantity 1,281 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O372Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells48000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4246528

Overview of LFE2M50SE-5F672I – ECP2M Field Programmable Gate Array (FPGA) IC 372 4246528 48000 672-BBGA

The LFE2M50SE-5F672I is an ECP2M family Field Programmable Gate Array (FPGA) supplied in a 672-ball BGA package. It provides a combination of high logic capacity, on-chip memory, and a large I/O count in a compact surface-mount footprint.

Key hardware characteristics include 48,000 logic elements, approximately 4.25 Mbits of embedded memory, 372 I/O pins, industrial-grade temperature operation from −40 °C to 100 °C, and a low-voltage supply range of 1.14 V to 1.26 V.

Key Features

  • Core Logic 48,000 logic elements provide substantial programmable logic capacity for complex digital designs.
  • Embedded Memory Approximately 4.25 Mbits of on-chip RAM to support buffering, state storage, and data processing functions.
  • I/O Density 372 general-purpose I/O pins enable high interconnectivity for multi-channel interfaces and peripheral integration.
  • Package 672-BBGA package (supplier device package: 672-FPBGA, 27×27) in a surface-mount form factor for compact board layouts.
  • Power Operates from a core voltage supply range of 1.14 V to 1.26 V, supporting low-voltage system designs.
  • Temperature and Grade Industrial grade operation with an ambient range of −40 °C to 100 °C for deployment in demanding environments.
  • RoHS Compliance Environmentally compliant manufacturing with RoHS status indicated.

Unique Advantages

  • High Logic Capacity: 48,000 logic elements allow for complex custom logic, enabling integration of multiple functions on a single device.
  • Substantial On-Chip Memory: Approximately 4.25 Mbits of embedded RAM reduces external memory requirements and simplifies board design.
  • Large I/O Count: 372 I/Os support dense peripheral, sensor, and interface connectivity without external expanders.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
  • Compact BGA Package: 672-ball BGA (27×27) provides a high-pin-count solution in a compact footprint to save PCB area.
  • Low-Voltage Operation: Core voltage range of 1.14 V–1.26 V supports low-power system architectures.

Why Choose LFE2M50SE-5F672I?

The LFE2M50SE-5F672I positions itself as a high-capacity, industrial-grade FPGA suitable for designs that require significant logic resources, substantial embedded memory, and a high I/O count in a compact BGA package. Its combination of 48,000 logic elements, approximately 4.25 Mbits of on-chip RAM, and 372 I/Os addresses integration needs where reducing external components and conserving PCB space are priorities.

With an industrial temperature rating and RoHS compliance, this device is targeted at long-life, robust deployments that demand consistent electrical and thermal performance. The low-voltage supply range and surface-mount 672-ball package make it compatible with modern, space-constrained board designs.

Request a quote or submit an inquiry to receive pricing and availability information for the LFE2M50SE-5F672I.

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