LFE2M50SE-5F672I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 372 4246528 48000 672-BBGA |
|---|---|
| Quantity | 1,281 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 372 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4246528 |
Overview of LFE2M50SE-5F672I – ECP2M Field Programmable Gate Array (FPGA) IC 372 4246528 48000 672-BBGA
The LFE2M50SE-5F672I is an ECP2M family Field Programmable Gate Array (FPGA) supplied in a 672-ball BGA package. It provides a combination of high logic capacity, on-chip memory, and a large I/O count in a compact surface-mount footprint.
Key hardware characteristics include 48,000 logic elements, approximately 4.25 Mbits of embedded memory, 372 I/O pins, industrial-grade temperature operation from −40 °C to 100 °C, and a low-voltage supply range of 1.14 V to 1.26 V.
Key Features
- Core Logic 48,000 logic elements provide substantial programmable logic capacity for complex digital designs.
- Embedded Memory Approximately 4.25 Mbits of on-chip RAM to support buffering, state storage, and data processing functions.
- I/O Density 372 general-purpose I/O pins enable high interconnectivity for multi-channel interfaces and peripheral integration.
- Package 672-BBGA package (supplier device package: 672-FPBGA, 27×27) in a surface-mount form factor for compact board layouts.
- Power Operates from a core voltage supply range of 1.14 V to 1.26 V, supporting low-voltage system designs.
- Temperature and Grade Industrial grade operation with an ambient range of −40 °C to 100 °C for deployment in demanding environments.
- RoHS Compliance Environmentally compliant manufacturing with RoHS status indicated.
Unique Advantages
- High Logic Capacity: 48,000 logic elements allow for complex custom logic, enabling integration of multiple functions on a single device.
- Substantial On-Chip Memory: Approximately 4.25 Mbits of embedded RAM reduces external memory requirements and simplifies board design.
- Large I/O Count: 372 I/Os support dense peripheral, sensor, and interface connectivity without external expanders.
- Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
- Compact BGA Package: 672-ball BGA (27×27) provides a high-pin-count solution in a compact footprint to save PCB area.
- Low-Voltage Operation: Core voltage range of 1.14 V–1.26 V supports low-power system architectures.
Why Choose LFE2M50SE-5F672I?
The LFE2M50SE-5F672I positions itself as a high-capacity, industrial-grade FPGA suitable for designs that require significant logic resources, substantial embedded memory, and a high I/O count in a compact BGA package. Its combination of 48,000 logic elements, approximately 4.25 Mbits of on-chip RAM, and 372 I/Os addresses integration needs where reducing external components and conserving PCB space are priorities.
With an industrial temperature rating and RoHS compliance, this device is targeted at long-life, robust deployments that demand consistent electrical and thermal performance. The low-voltage supply range and surface-mount 672-ball package make it compatible with modern, space-constrained board designs.
Request a quote or submit an inquiry to receive pricing and availability information for the LFE2M50SE-5F672I.

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