LFE2M50SE-5F900I

The LFE2M50SE-5F900I is an ECP2M family FPGA from Lattice Semiconductor Corporation configured in a 900-ball BGA package. It provides a mid-range combination of logic capacity, embedded memory, and high I/O count for designs requiring flexible programmable logic in a compact surface-mount form factor.

With 48,000 logic elements, approximately 4.25 Mbits of embedded memory and 410 user I/Os, this industrial-grade device is suited to designs that need substantial on-chip resources, robust I/O capability and operation across an extended temperature range.

Key Features

• Logic Resources  48,000 logic elements to implement custom digital functions and moderate-to-complex logic designs.
• Embedded Memory  Approximately 4.25 Mbits (4,246,528 bits) of on-chip RAM for data buffering, packet storage, or local state retention.
• I/O Capacity  410 user I/Os to support wide peripheral connectivity and parallel interfaces without extensive external glue logic.
• Power Supply  Core supply range of 1.14 V to 1.26 V to match required FPGA core voltage specifications.
• Package and Mounting  900-ball BGA (supplier device package: 900-FPBGA, 31×31 mm) in a surface-mount form factor for compact board integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in extended-temperature environments.
• Regulatory  RoHS compliant, meeting common lead-free and environmental requirements for modern assemblies.

Typical Applications

• Embedded Systems  Use the device’s 48,000 logic elements and large I/O count to implement custom control, protocol handling, and peripheral aggregation in embedded platforms.
• Communications and Networking  Leverage the embedded memory and abundant I/Os for packet buffering, interface bridging and mid-range datapath logic.
• Industrial Control  Industrial-grade temperature rating and robust I/O support sensor interfacing, PLC functions and motion-control logic in factory and process environments.
• Test and Measurement  On-chip memory and reprogrammable logic enable flexible signal processing, data capture and instrument control functions.

Unique Advantages

• Substantial On-Chip Logic: 48,000 logic elements provide a balance of capacity for mid-range FPGA designs without requiring larger packages.
• Large Embedded Memory: Approximately 4.25 Mbits of RAM supports buffering and local storage to reduce external memory needs.
• High I/O Count: 410 I/Os reduce the need for external multiplexing and simplify integration with multiple peripherals and interfaces.
• Industrial Temperature Operation: Rated from −40 °C to 100 °C for deployment in environments with wide thermal ranges.
• Compact BGA Package: 900-ball FPBGA (31×31 mm) provides high pin density in a surface-mount package suitable for space-constrained PCBs.
• RoHS Compliant: Supports lead-free assembly and environmental compliance requirements.

Why Choose LFE2M50SE-5F900I?

The LFE2M50SE-5F900I positions itself as a mid-range FPGA option that combines sizeable logic capacity, multi-megabit embedded RAM and a high I/O count in a compact 900-ball BGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for production designs that need reliable operation across extended temperature ranges.

This device is well suited to engineers designing embedded systems, communications equipment, industrial controllers and test instruments who require programmable logic with substantial on-chip resources and flexible I/O. The combination of core voltage specification, package density and memory resources supports scalable implementation choices while maintaining board-level integration efficiency.

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