LFE2M50SE-5FN484I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 270 4246528 48000 484-BBGA |
|---|---|
| Quantity | 1,510 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 270 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4246528 |
Overview of LFE2M50SE-5FN484I – ECP2M Field Programmable Gate Array (FPGA)
The LFE2M50SE-5FN484I is an ECP2M field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It provides a high-capacity logic fabric with 48,000 logic elements, approximately 4.25 Mbits of embedded memory (4,246,528 bits), and 270 I/O pins in a 484-BBGA package.
Specified for industrial use, this device operates from a 1.14 V to 1.26 V supply and across an operating temperature range of -40 °C to 100 °C. The 484-FPBGA (23×23) supplier package and surface-mount mounting support compact board-level integration while meeting RoHS compliance requirements.
Key Features
- Core Capacity 48,000 logic elements provide on-chip programmable logic resources for implementing complex digital functions.
- Embedded Memory Approximately 4.25 Mbits of on-chip RAM (4,246,528 bits) for data buffering, state storage, and local memory needs.
- I/O Resources 270 I/O pins to support extensive external interfacing and parallel connectivity options.
- Power Narrow supply voltage range of 1.14 V to 1.26 V for the core, enabling defined power-rail design.
- Package & Mounting 484-BBGA package; supplier device package 484-FPBGA (23×23). Surface mount device suitable for modern assembly processes.
- Temperature & Grade Industrial grade device rated for operation from -40 °C to 100 °C for thermally demanding environments.
- Environmental Compliance RoHS compliant to meet regulatory requirements for lead-free manufacturing.
Unique Advantages
- High logic density: 48,000 logic elements reduce the need for external programmable logic or glue logic, consolidating functions on a single IC.
- Significant on-chip memory: Approximately 4.25 Mbits of embedded RAM enable local buffering and state retention without external memory.
- Extensive I/O availability: 270 I/Os provide flexibility for wide peripheral and bus connectivity directly from the FPGA.
- Industrial temperature capability: -40 °C to 100 °C rating supports deployment in environments with wide temperature swings.
- Predictable power requirement: A defined 1.14 V to 1.26 V core supply simplifies power-rail design and regulation.
- Compact BGA footprint: 484-FPBGA (23×23) package supports high-density PCB layouts and surface-mount assembly.
Why Choose LFE2M50SE-5FN484I?
The LFE2M50SE-5FN484I combines substantial programmable logic, significant embedded memory, and a large number of I/Os in a compact 484-BBGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for designs requiring on-chip integration of logic and memory with robust environmental performance.
Engineers and procurement teams looking for a surface-mount FPGA with defined power requirements, high I/O count, and a 23×23 mm FPBGA footprint will find this device aligns with designs that prioritize integration, thermal range, and compliance.
Request a quote or submit an inquiry to obtain pricing and availability for LFE2M50SE-5FN484I.
