LFE2M50SE-5FN900I

The LFE2M50SE-5FN900I is an ECP2M FPGA from Lattice Semiconductor packaged in a 900-ball BGA (31 × 31 mm). It delivers 48,000 logic elements and approximately 4.25 Mbits of embedded memory for mid-density programmable logic needs.

Designed for industrial-grade applications, this device supports up to 410 I/O pins and operates over a supply range of 1.14 V to 1.26 V and an ambient temperature range of −40 °C to 100 °C, making it suitable for systems that require high I/O count, on-chip memory, and rugged operating conditions.

Key Features

• Logic Capacity 48,000 logic elements provide a flexible fabric for implementing complex custom logic, state machines, and data-path functions.
• Embedded Memory Approximately 4.25 Mbits of on-chip RAM to support buffering, look-up tables, and small packet or frame storage.
• High I/O Count Up to 410 I/O pins accommodate dense peripheral connectivity and multi-channel interfacing without external I/O expanders.
• Power Supply Operates from a core voltage range of 1.14 V to 1.26 V, compatible with modern low-voltage power domains.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet the environmental requirements of industrial and harsh-environment systems.
• Package and Mounting 900-ball FBGA (31 × 31 mm) package in surface-mount format provides a compact, high-density solution for board-level integration.
• RoHS Compliant Meets RoHS environmental standards for lead-free assembly and regulatory compliance.

Typical Applications

• Industrial Automation — Implements control logic, sensor aggregation, and deterministic I/O handling while operating across an industrial temperature range.
• High-Density I/O Systems — Supports designs requiring many external interfaces or parallel channels thanks to its 410 available I/O pins.
• Embedded Processing and Custom Logic — Combines 48,000 logic elements with embedded memory for application-specific datapath acceleration and protocol handling.
• Communications and Networking Modules — On-chip memory and logic resources enable data buffering, framing, and protocol adaptation in mid-range networking equipment.

Unique Advantages

• Balanced Logic and Memory: 48,000 logic elements paired with approximately 4.25 Mbits of embedded RAM support a wide range of logic-plus-memory implementations without heavy external memory reliance.
• High I/O Integration: Up to 410 I/O pins reduce the need for external multiplexers or expanders, simplifying board design and lowering BOM complexity.
• Industrial Reliability: Specified operation from −40 °C to 100 °C helps ensure stable operation in industrial and harsh-environment applications.
• Compact, High-Density Packaging: The 900-ball FBGA (31 × 31 mm) package provides a small footprint for high-pin-count designs, enabling dense system integration.
• Low-Voltage Core: Narrow core supply range (1.14 V–1.26 V) aligns with modern low-voltage power architectures for efficient system power design.
• RoHS Compliance: Facilitates lead-free manufacturing and regulatory conformance for commercial deployments.

Why Choose LFE2M50SE-5FN900I?

The LFE2M50SE-5FN900I positions itself as a mid-density, industrial-grade FPGA that balances logic capacity, embedded memory, and a large I/O count in a compact 900-BBGA package. It is suited for engineers designing industrial control systems, I/O-intensive modules, and embedded processing blocks where robust temperature operation and high pin-count integration are required.

Choosing this FPGA provides a scalable, integrated solution that reduces external component needs, supports rugged operating conditions, and aligns with RoHS requirements—delivering a practical option for production designs that need reliable programmable logic and on-chip memory resources.

Request a quote or submit a sales inquiry to get pricing, availability, and further technical details for the LFE2M50SE-5FN900I.