LFE2M50SE-6F484I

The LFE2M50SE-6F484I is an ECP2M Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for industrial applications. It delivers a balance of logic capacity, embedded memory, and high I/O density in a compact 484-ball BGA package suitable for surface-mount assembly.

With 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and 270 I/Os, this device targets designs that require mid-range programmable logic, significant on-chip RAM, and robust operating conditions, supported by a low nominal core supply range.

Key Features

• Core Capacity 48,000 logic elements provide programmable logic resources for implementing custom digital functions and control logic.
• Embedded Memory Approximately 4.25 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Count 270 general-purpose I/Os to accommodate wide bus interfaces, multiple peripherals, and complex signal routing.
• Power Core voltage supply range of 1.14 V to 1.26 V for compatibility with low-voltage system designs.
• Package and Mounting 484-ball BGA (484-FPBGA, 23×23) in a 484-BBGA package suited for surface-mount PCB assembly and high-density layouts.
• Industrial Temperature Range Rated for operation from −40°C to 100°C, aligning with industrial and rugged application requirements.
• Regulatory Compliance RoHS compliant, supporting lead-free manufacturing processes and environmental requirements.

Typical Applications

• Industrial Control and Automation — The industrial temperature rating and high I/O count make this FPGA suitable for sensor interfacing, control logic, and factory-automation modules.
• Embedded Processing and Acceleration — 48,000 logic elements and substantial on-chip RAM support custom accelerators, protocol processing, and embedded state machines.
• High-Density I/O Systems — With 270 I/Os in a compact BGA package, the device fits applications requiring extensive peripheral connectivity in space-constrained boards.

Unique Advantages

• High Logic Capacity: 48,000 logic elements enable complex logic implementations without external programmable devices.
• Significant On-Chip Memory: Approximately 4.25 Mbits of embedded RAM reduces dependency on external memory for buffering and local data storage.
• Extensive I/O Count: 270 I/Os provide flexibility for multi-channel interfaces and parallel data paths, simplifying board-level design.
• Industrial Robustness: −40°C to 100°C operating range supports deployment in demanding environmental conditions.
• Compact, Assembly-Friendly Package: 484-ball BGA (484-FPBGA, 23×23) delivers high density while remaining compatible with standard surface-mount processes.
• RoHS Compliant: Meets environmental requirements for lead-free manufacturing.

Why Choose LFE2M50SE-6F484I?

The LFE2M50SE-6F484I positions itself as a mid-range FPGA option that combines substantial logic resources, embedded memory, and high I/O density within a compact BGA footprint. Its low-voltage core range and industrial temperature specification make it suitable for designs that require reliable operation across a wide range of conditions.

This device is well suited for engineers building industrial control systems, embedded accelerators, and high-density I/O assemblies who need a programmable, RoHS-compliant solution with on-chip memory and broad interfacing capability. Its balance of capacity and package density supports scalable designs and streamlined BOMs.

Request a quote or contact sales to discuss pricing and availability for LFE2M50SE-6F484I.