LFE2M50SE-5FN900C

The LFE2M50SE-5FN900C is an ECP2M-family FPGA in a 900‑ball BGA package designed for high-density, system‑level integration. It provides 48,000 logic elements, extensive on‑chip memory, and up to 410 I/Os to support complex embedded and communications applications.

Built on the Lattice ECP2/M architecture, this device targets applications that require a mix of high logic capacity, abundant I/O, flexible memory resources, and family-level features such as high‑speed embedded SERDES and advanced DSP blocks.

Key Features

• Logic Capacity — 48,000 logic elements for implementing large, complex digital designs.
• Embedded Memory — 4,246,528 bits of on‑chip RAM (approximately 4.25 Mbits) for large buffering, packet processing, and data storage.
• I/O Density — Up to 410 user I/Os to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting — 900‑BBGA (900‑FPBGA, 31 × 31 mm) in a surface‑mount format for compact, high‑density board designs.
• Power Supply — Core voltage range 1.14 V to 1.26 V to match system power rails.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• Family SERDES Support — Lattice ECP2M family supports embedded SERDES with data rates from 250 Mbps to 3.125 Gbps and up to 16 channels per device (family feature).
• Enhanced DSP and Clocking (Family Features) — Family includes sysDSP blocks sized for efficient multiply/accumulate operations and multiple PLL/DLL resources for flexible clock management.
• Standards & Interfaces (Family Support) — Programmable I/O supports a wide range of standards and dedicated source‑synchronous features for DDR interfaces and high‑speed ADC/DAC connectivity (family-level capabilities).
• RoHS Compliant — Device meets RoHS requirements for lead‑free assembly.

Typical Applications

• Networking & Communications — Protocol offload, packet processing, and backplane interfacing leveraging high I/O count and family SERDES capability.
• High‑Speed Data Conversion — Front-end interfacing for ADC/DAC systems using dedicated source‑synchronous I/O and on‑chip RAM for buffering.
• Memory Interfaces — DDR/DDR2 memory controllers and timing‑sensitive buffering using embedded memory and dedicated DQS support at the family level.
• Signal Processing — DSP‑oriented designs using the family’s sysDSP blocks for multiply‑accumulate workloads and streaming data paths.

Unique Advantages

• High Integration Density: 48,000 logic elements and approximately 4.25 Mbits of embedded memory reduce the need for external components and simplify board-level design.
• Scalable I/O: 410 I/Os enable broad connectivity options for multi-channel and mixed-signal systems.
• Package Optimization: 900‑ball BGA (31 × 31 mm) delivers high pin count in a compact footprint for space-constrained applications.
• Family-Level High‑Speed SerDes: Support for multi‑hundred Mbps to multi‑Gbps serial links (family capability) makes the ECP2M family suitable for modern communications interfaces.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match typical commercial embedded deployments.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing and assembly processes.

Why Choose LFE2M50SE-5FN900C?

The LFE2M50SE-5FN900C combines substantial logic capacity, abundant on‑chip memory, and a high I/O count in a compact 900‑ball BGA package—making it appropriate for embedded systems, communications equipment, and data‑centric designs that require dense integration. As part of the Lattice ECP2M family, it benefits from family-level features such as high‑speed SERDES, advanced DSP resources, and flexible clocking options that help accelerate system-level implementation.

This device is well suited to engineers and procurement teams looking for a commercially graded FPGA with verifiable on‑chip resources, clear power and temperature requirements, and RoHS compliance for standard industrial and commercial product lines.

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