LFE2M50SE-6F484C

The LFE2M50SE-6F484C is an ECP2M Field Programmable Gate Array (FPGA) offered in a 484-BBGA (484-FPBGA, 23×23) surface-mount package. It delivers 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and up to 270 general-purpose I/O pins for dense, integrated digital designs.

Designed for commercial-grade applications, this device operates from a 1.14 V to 1.26 V supply and supports an ambient operating range of 0 °C to 85 °C. It is RoHS compliant for environmental conformance.

Key Features

• Core Capacity 48,000 logic elements provide significant resources for implementing custom digital functions and complex state machines.
• Embedded Memory Approximately 4.25 Mbits of on-chip RAM to support buffering, FIFOs, and memory-mapped logic without external memory.
• I/O Density Up to 270 I/O pins to support multiple peripherals, parallel interfaces, and signal routing in compact systems.
• Power Operates from a 1.14 V to 1.26 V supply, enabling integration into low-voltage system domains.
• Package & Mounting 484-BBGA (484-FPBGA, 23×23) package in a surface-mount form factor for space-efficient PCB layouts.
• Commercial Grade & Temperature Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• Environmental Compliance RoHS compliant for reduced hazardous substance content.

Typical Applications

• High-density interface aggregation Use the device’s 270 I/Os to consolidate multiple parallel and serial interfaces on a single FPGA.
• Embedded memory-dependent logic Leverage approximately 4.25 Mbits of on-chip RAM for buffering, packet handling, or data staging without relying on external memory.
• Custom digital signal control Implement medium-to-large custom logic functions with the 48,000 logic elements for protocol handling, control logic, or glue logic.
• Compact system integration The 484-BBGA surface-mount package supports high-density PCB integration where board space is constrained.

Unique Advantages

• Balanced resource mix: Combines a high logic element count with substantial embedded memory to support both computational logic and data buffering on-chip.
• High I/O capacity: 270 I/Os enable flexible connectivity and reduce the need for additional interface components.
• Compact packaging: The 484-FPBGA (23×23) package provides a small footprint for high-density board designs while retaining abundant signal access.
• Low-voltage operation: Narrow 1.14 V–1.26 V supply range facilitates integration into modern low-voltage systems.
• Commercial temperature suitability: Rated for 0 °C–85 °C operation for typical commercial electronic products and environments.
• RoHS compliant: Helps meet environmental and regulatory requirements for many markets.

Why Choose LFE2M50SE-6F484C?

The LFE2M50SE-6F484C positions itself as a commercially graded FPGA option that combines a substantial logic resource pool (48,000 logic elements) with significant on-chip memory (approximately 4.25 Mbits) and a high I/O count (270 pins) in a compact 484-BBGA package. Its low-voltage supply range and surface-mount form factor make it suitable for space-constrained designs that require integrated memory and flexible interfacing.

This device is well suited for designers and teams building mid-to-high complexity digital systems who need on-chip memory, abundant I/O, and a commercial temperature rating. Its RoHS compliance and standard package options support practical manufacturability and environmental considerations.

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