LFE2M50SE-6F900C

The LFE2M50SE-6F900C is an ECP2M family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, delivered in a 900-ball BGA package. It combines a high logic density with substantial on-chip memory and a large number of I/O pins, making it suitable for designs that require significant integration of logic, memory, and interfacing.

With 48,000 logic elements, approximately 4.25 Mbits of embedded memory and 410 I/O, this commercial-grade, surface-mount FPGA targets applications where compact packaging, moderate supply voltage operation, and RoHS compliance are important design considerations.

Key Features

• Core Logic 48,000 logic elements provide substantial programmable logic capacity for glue logic, protocol handling, and custom hardware acceleration.
• Embedded Memory Approximately 4.25 Mbits of on-chip RAM for buffering, FIFOs, and local data storage without external memory.
• I/O Density 410 I/O pins to support multiple interfaces, parallel buses, and extensive signal routing in I/O-heavy designs.
• Power Operates from a 1.14 V to 1.26 V supply range to match system power domains and optimize board-level power design.
• Package & Mounting 900-ball BGA (supplier package: 900-FPBGA, 31 × 31 mm) in a surface-mount form factor for compact PCB layouts.
• Temperature & Grade Commercial grade operation with an ambient rating of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for regulatory and manufacturing process alignment.

Typical Applications

• I/O-Intensive Interface Bridging Use the 410 I/O pins to implement protocol conversion, bus bridging, or multi-channel interface aggregation without extensive external logic.
• Embedded Control & Glue Logic Leverage 48,000 logic elements and on-chip RAM to consolidate control functions and reduce component count in embedded systems.
• Buffering and Local Storage Approximately 4.25 Mbits of embedded memory supports data buffering, temporary storage, and FIFO implementations for data-stream handling.

Unique Advantages

• High Logic Density: The 48,000 logic elements enable complex designs and feature integration within a single device.
• Generous On-Chip Memory: Approximately 4.25 Mbits of embedded RAM reduces the need for external memory in many designs.
• Extensive I/O Capability: 410 I/O pins allow integration of multiple interfaces and parallel connections on compact PCBs.
• Compact BGA Package: The 900-ball FPBGA (31 × 31 mm) balances pin count and PCB area for dense system designs.
• RoHS Compliant & Commercial Grade: Meets RoHS requirements and operates across a 0 °C to 85 °C range for standard commercial applications.

Why Choose LFE2M50SE-6F900C?

The LFE2M50SE-6F900C positions itself as a versatile, integration-focused FPGA offering substantial logic resources, on-chip memory, and a high I/O count in a compact BGA package. It is well suited to designers looking to consolidate functionality, reduce BOM complexity, and implement I/O-rich systems within commercial temperature environments.

Engineers targeting protocol bridging, embedded control, or local data buffering will find the combination of 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and 410 I/O pins valuable for scalable, board-level implementations while maintaining RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability information for LFE2M50SE-6F900C.