LFE2M50SE-6FN484C

The LFE2M50SE-6FN484C is a Lattice ECP2M-family FPGA in a 484-ball BGA package designed for complex embedded logic and high-density I/O integration. This commercial-grade, surface-mount device combines 48,000 logic elements with approximately 4.25 Mbits of on-chip RAM and 270 user I/Os to support data-path, protocol bridging and embedded-control applications.

With a 1.14 V to 1.26 V supply range and an operating temperature of 0 °C to 85 °C, the device targets mid-range networking, communications and high-performance embedded systems that require significant logic density, abundant memory and flexible I/O in a compact BGA footprint.

Key Features

• Core Logic — 48,000 logic elements for implementing complex RTL, control logic and data-path functions.
• On-chip Memory — Total RAM of 4,246,528 bits (approximately 4.25 Mbits) to support buffers, FIFOs and embedded state storage.
• I/O Capacity — 270 user I/Os to accommodate multiple interfaces, peripheral connections and high-pin-count designs.
• Family-level SERDES (LatticeECP2M) — ECP2M family devices provide embedded SERDES capabilities with data rates from 250 Mbps to 3.125 Gbps and up to 16 channels per device, suitable for serial protocol links and high-speed chip-to-chip interfaces.
• sysDSP and Multiplier Support (Family) — Family-level sysDSP blocks provide high-performance multiply-accumulate resources; blocks can support 36×36, 18×18 or 9×9 multipliers for DSP acceleration.
• Clock Management (Family) — General-purpose and system PLL/DLL resources available in the family (GPLLs, SPLLs, DLLs) for clock multiply/divide and phase/delay adjustments.
• Flexible Configuration (Family) — Family features include SPI boot flash interface, dual boot image support, TransFR I/O for field updates and optional bitstream encryption for “S” versions.
• Package & Mounting — 484-ball fpBGA package (484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board-level integration.
• Commercial Temperature & Supply — Rated for 0 °C to 85 °C operation with a core supply range of 1.14 V to 1.26 V; RoHS compliant.

Typical Applications

• Networking & Communications — Implement protocol bridging, packet processing and interface logic using the device’s high logic density, on-chip RAM and ECP2M family SERDES support for Ethernet, PCIe and other serial links.
• Data Acquisition & Instrumentation — Use embedded memory and extensive I/Os to buffer and preprocess sensor or ADC/DAC data streams in test and measurement systems.
• Embedded Computation — Offload math-intensive kernels to sysDSP resources and on-chip RAM to accelerate signal processing and control algorithms.
• Prototype & System Integration — Leverage the dense logic and flexible configuration options for rapid prototyping, functional integration and system-level consolidation on compact PCBs.

Unique Advantages

• High logic and memory density: 48,000 logic elements paired with ~4.25 Mbits of RAM enables large designs and deep buffering without external SRAM for many use cases.
• Rich I/O count: 270 user I/Os support multiple parallel interfaces and mixed-signal front-ends while minimizing board-level multiplexing.
• Compact BGA package: 484-ball fpBGA (23 × 23 mm) delivers considerable capacity in a space-efficient, surface-mount form factor for dense board layouts.
• Family SERDES and DSP acceleration: ECP2M family-level SERDES and sysDSP blocks enable high-speed serial links and on-chip arithmetic acceleration for communication and signal-processing tasks.
• Flexible configuration and field updates: SPI boot, dual-boot image capability and TransFR I/O options (family features) simplify in-field updates and secure deployment strategies.
• Commercial operating range and RoHS compliance: Designed for standard commercial temperature operation (0 °C to 85 °C) and RoHS environmental compliance.

Why Choose LFE2M50SE-6FN484C?

The LFE2M50SE-6FN484C positions itself as a high-density, mid-range FPGA solution for designers needing substantial logic capacity, on-chip RAM and a large I/O complement in a compact BGA package. Its family-level support for high-speed SERDES, DSP primitives and flexible configuration options makes it suitable for communications, embedded processing and data-acquisition designs where integration and I/O density matter.

This device is well suited for teams aiming to consolidate system functions, accelerate signal processing tasks and implement multi-protocol interfaces while maintaining a commercial temperature profile and RoHS compliance. The Lattice ECP2M family ecosystem provides the architectural primitives and configuration options to scale designs within the family.

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