LFE2M50SE-6F900I

The LFE2M50SE-6F900I is an ECP2M Field Programmable Gate Array (FPGA) in a 900-ball BGA package designed for industrial applications. It integrates a high count of logic elements, significant on-chip memory, and a large number of I/O to support complex, I/O‑dense designs.

Key value comes from its combination of capacity (48,000 logic elements), approximately 4.25 Mbits of embedded memory, and a 410-pin I/O interface, all in a compact 900‑BBGA (31 × 31 mm) surface‑mount package with industrial temperature rating.

Key Features

• Core Logic  48,000 logic elements to implement moderate-to-large custom logic, state machines and glue‑logic functions.
• Embedded Memory  Approximately 4.25 Mbits of on‑chip RAM (4,246,528 bits) for buffering, FIFOs and local storage.
• I/O Density  410 available I/O pins to support wide parallel interfaces, multiple peripherals and complex I/O routing.
• Power  Supports a core voltage supply range of 1.14 V to 1.26 V for operation within defined power rails.
• Package and Mounting  900‑BBGA package (supplier device package: 900‑FPBGA, 31 × 31 mm) in a surface‑mount form factor for high‑density board designs.
• Temperature Range  Industrial operating temperature range from −40 °C to 100 °C suitable for demanding environmental conditions.
• Compliance  RoHS compliant to meet environmental and regulatory requirements for lead‑free assembly.

Typical Applications

• Industrial Control  Implement real‑time control logic, protocol bridging and custom I/O handling in factory automation and industrial equipment.
• Communications Equipment  Support interface conversion, packet buffering and custom protocol processing with high I/O counts and embedded memory.
• Instrumentation and Test  Build data acquisition front ends, signal aggregation and preprocessing functions leveraging on‑chip RAM and abundant I/O.

Unique Advantages

• High Logic Capacity: 48,000 logic elements provide substantial programmable resources for complex FPGA designs.
• Significant On‑Chip Memory: Approximately 4.25 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage.
• Large I/O Count: 410 I/O pins enable integration of multiple parallel interfaces and sensors without extensive external multiplexing.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh or temperature‑variable environments.
• Compact BGA Package: 900‑BBGA (31 × 31 mm) surface‑mount package balances density and thermal/mechanical stability for production boards.
• RoHS Compliant: Meets lead‑free assembly requirements for modern manufacturing processes.

Why Choose LFE2M50SE-6F900I?

The LFE2M50SE-6F900I positions itself as a versatile industrial FPGA that combines substantial logic resources, embedded memory, and a high I/O count in a compact 900‑BBGA package. It is suited to design teams needing a programmable platform for industrial control, communications, and instrumentation tasks where on‑chip capacity and I/O density are important.

Choosing this device provides a scalable, robust building block for designs that require mid‑to‑high logic capacity, meaningful local memory, and operation across an industrial temperature range, backed by RoHS compliance for modern production standards.

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