LFE2M50SE-6FN672I

The LFE2M50SE-6FN672I is an ECP2M Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It combines substantial on-chip logic, embedded memory and a high I/O count in a compact 672‑ball BGA package for industrial-grade deployments.

With 48,000 logic elements, approximately 4.25 Mbits of embedded RAM and 372 I/O pins, this device targets designs that require significant programmable logic, memory resources and connectivity while operating across an industrial temperature range.

Key Features

• Core Logic  Provides 48,000 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory  Approximately 4.25 Mbits of on-chip RAM for buffering, frame storage and intermediate data processing.
• I/O Resources  372 user I/O pins to support extensive external connectivity and reduce the need for additional interface components.
• Power  Operates from a supply range of 1.14 V to 1.26 V, enabling designs that match this core voltage window.
• Package & Mounting  672‑BBGA package (supplier device package: 672‑FPBGA, 27×27) in a surface‑mount form factor for high pin density.
• Operating Range & Grade  Industrial grade device rated for operation from -40 °C to 100 °C.
• Environmental Compliance  RoHS compliant to support lead‑free assembly requirements.

Typical Applications

• Industrial Automation  Control logic, sensor interfacing and PLC functions that benefit from high I/O counts and industrial temperature tolerance.
• Communications Equipment  Protocol bridging, interface adaptation and packet handling where on-chip logic and memory reduce external components.
• Test and Measurement  Real‑time data aggregation and preprocessing using the device’s embedded RAM and programmable logic resources.
• Signal Processing  Embedded filtering, framing and intermediate processing tasks that fit within the available logic and memory resources.

Unique Advantages

• High logic density: 48,000 logic elements enable implementation of sizable custom logic blocks without external CPLDs or FPGAs.
• Substantial on‑chip memory: Approximately 4.25 Mbits of embedded RAM helps minimize external memory requirements for buffering and intermediate storage.
• Extensive connectivity: 372 I/O pins support direct interfacing to multiple peripherals and subsystems, reducing glue logic and board complexity.
• Industrial robustness: Rated for -40 °C to 100 °C operation, making it suitable for harsh or temperature‑variable environments.
• Compact, high‑pin package: 672‑BBGA (672‑FPBGA, 27×27) delivers high pin density in a surface‑mount footprint for space‑constrained designs.
• RoHS compliant: Supports lead‑free manufacturing processes and environmental compliance requirements.

Why Choose LFE2M50SE-6FN672I?

The LFE2M50SE-6FN672I positions itself as a solid choice for industrial applications that require a balanced mix of programmable logic, embedded memory and high I/O capacity in a compact BGA package. Its 48,000 logic elements and approximately 4.25 Mbits of RAM provide the headroom needed for complex control, interfacing and preprocessing tasks while the industrial temperature rating supports deployment in demanding environments.

This FPGA is suited for engineering teams designing mid‑to‑high‑complexity systems that need reliable programmable resources, substantial connectivity and a surface‑mount 672‑BBGA form factor. Its combination of logic density, memory and I/O makes it a practical option for reducing external components and consolidating functions on a single device.

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