LFE2M50SE-6FN900I
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 410 4246528 48000 900-BBGA |
|---|---|
| Quantity | 1,492 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FPBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA | Number of I/O | 410 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4246528 |
Overview of LFE2M50SE-6FN900I – ECP2M Field Programmable Gate Array (FPGA) IC, 900-BBGA
The LFE2M50SE-6FN900I is an ECP2M Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for FPGA-based digital designs that require a balance of logic capacity, embedded memory and I/O density. It ships in a 900-BBGA surface-mount package (900-FPBGA, 31×31) and is specified for industrial use.
Key on-chip resources include 48,000 logic elements and approximately 4.25 Mbits of embedded RAM. The device supports up to 410 I/O pins, operates from a 1.14 V to 1.26 V supply range, and is rated for operation from −40 °C to 100 °C. The device is RoHS compliant.
Key Features
- Logic Capacity 48,000 logic elements to implement complex digital functions and custom logic blocks.
- Embedded Memory Approximately 4.25 Mbits of on-chip RAM for buffering, FIFOs and state storage.
- I/O Density Up to 410 general-purpose I/O pins to support wide parallel interfaces and rich connectivity options.
- Package & Mounting 900-BBGA package (900-FPBGA, 31×31) in a surface-mount form factor for high pin-count, space-efficient board designs.
- Power Operates from a low-voltage supply range of 1.14 V to 1.26 V to match modern system rails.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation, supporting deployment in industrial environments.
- Compliance RoHS compliant.
Unique Advantages
- High logic density: 48,000 logic elements provide capacity for sizable custom digital designs without external logic expansion.
- Substantial embedded memory: Approximately 4.25 Mbits of on-chip RAM reduces reliance on external memory for many buffering and stateful tasks.
- Large I/O count: 410 I/Os enable direct interfacing to multiple peripherals, sensors and parallel bus systems.
- Industrial-ready temperature range: Specified operation from −40 °C to 100 °C supports deployment in demanding environments.
- Compact, high-pin-count packaging: 900-BBGA (900-FPBGA, 31×31) balances high connectivity with a board-space-efficient footprint.
- Low-voltage operation: Narrow supply range (1.14 V–1.26 V) aligns with low-voltage system architectures.
Why Choose LFE2M50SE-6FN900I?
The LFE2M50SE-6FN900I combines a significant logic fabric (48,000 logic elements) with approximately 4.25 Mbits of embedded RAM and up to 410 I/Os, packaged in a 900-BBGA surface-mount part rated for industrial temperatures. These attributes make it well suited for designers who need a high-density, high-I/O FPGA solution within a compact board footprint.
As an offering from Lattice Semiconductor Corporation with RoHS compliance, this device provides a deterministic set of resources and environmental ratings that support medium- to high-complexity digital designs where integration, I/O capability and temperature robustness are important considerations.
Request a quote or contact our sales team to discuss pricing, lead times and availability for the LFE2M50SE-6FN900I.
