LFE2M50SE-6FN484I

The LFE2M50SE-6FN484I is an ECP2M family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a programmable fabric with 48,000 logic elements and embedded memory to implement custom digital functions and glue logic in industrial designs.

With 270 I/Os, a compact 484-ball BGA package, and an industrial operating range, this device targets applications that require moderate logic density, substantial on-chip RAM, and a robust package and temperature specification.

Key Features

• Programmable Logic Capacity — 48,000 logic elements and 6,000 CLBs providing the programmable resources to implement complex digital functions and control logic.
• Embedded Memory — Approximately 4.25 Mbits of on-chip RAM (4,246,528 total RAM bits) for buffering, FIFOs, and embedded data storage.
• I/O Density — 270 dedicated I/O pins to support a wide range of external interfaces and peripheral connectivity.
• Core Voltage Range — Core supply requirement from 1.14 V to 1.26 V for consistent core operation across system conditions.
• Package & Mounting — 484-ball BBGA package (supplier device package 484-FPBGA, 23 × 23 mm) in a surface-mount form factor suitable for board-level assembly.
• Industrial Grade & Temperature Range — Specified industrial grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• High-density logic and signal processing — Use the 48,000 logic elements and approximately 4.25 Mbits of embedded memory for complex combinational and sequential logic, signal processing blocks, and buffering.
• Multi-interface bridging — 270 I/Os enable integration and protocol bridging between multiple external devices and subsystems on a single FPGA.
• Industrial control and automation — Industrial-grade temperature range and surface-mount BGA package make the device suitable for embedded controllers and automation equipment.

Unique Advantages

• Balanced logic and memory resources: Combination of 48,000 logic elements and approximately 4.25 Mbits of embedded RAM supports designs that need both combinational logic and on-chip storage.
• High I/O count: 270 I/Os reduce the need for external multiplexing or IO expanders, simplifying board-level design.
• Compact BGA package: 484-ball FPBGA (23 × 23 mm) provides a high-density footprint for space-constrained applications while supporting surface-mount assembly.
• Industrial temperature support: Rated from −40 °C to 100 °C for reliable operation in a wide range of industrial environments.
• Controlled core supply range: 1.14 V to 1.26 V core voltage specification supports predictable power sequencing and system design.
• RoHS compliant: Conforms to RoHS environmental requirements for lead-free assembly.

Why Choose LFE2M50SE-6FN484I?

The LFE2M50SE-6FN484I delivers a well-rounded FPGA solution with substantial logic density, significant on-chip RAM, and a high I/O count in a compact 484-ball BGA package. Its industrial temperature rating and surface-mount form factor make it suitable for embedded and industrial system designs that demand reliable programmable logic and memory integration.

This device is ideal for engineers and procurement teams seeking a mid-to-high density FPGA with ample I/O and embedded memory, offering scalability and predictable electrical and thermal characteristics for long-term deployments.

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