LFE2M50SE-6FN672C

The LFE2M50SE-6FN672C is a Lattice Semiconductor ECP2M family Field Programmable Gate Array (FPGA) delivered in a 672-ball BGA package. It integrates approximately 48,000 logic elements, a high I/O count (372 pins), and approximately 4.25 Mbits of embedded RAM to address demanding system integration tasks.

Built for applications that require a mix of programmable logic, DSP acceleration and high-speed serial connectivity, this commercial-grade device offers on-chip clocking, advanced I/O support and SERDES capability as defined for the LatticeECP2/M family.

Key Features

• Logic Capacity  Approximately 48,000 logic elements provide substantial combinational and sequential resources for complex FPGA designs.
• Embedded Memory  Approximately 4.25 Mbits of on-chip RAM (total RAM bits: 4,246,528) for FIFOs, buffering and local data storage.
• High I/O Count  372 user I/O pins support wide external connectivity and complex board-level interfacing.
• sysDSP Blocks  Family-level sysDSP blocks provide dedicated multiply-accumulate capability for signal processing and algorithm acceleration.
• Embedded SERDES  LatticeECP2M family SERDES support high-speed serial links (data rates from 250 Mbps to 3.125 Gbps) for serial protocols and backplane or chip-to-chip interfaces.
• Clocking Resources  On-chip PLLs and DLLs (family supports general-purpose and system PLL/DLL structures) for flexible clock multiplication, division and phase adjustment.
• Flexible I/O Standards  Programmable I/O buffer support across a wide range of single-ended and differential standards (family-level detail) to match diverse interface requirements.
• Configuration and Security  Family features include SPI boot flash interface, dual boot images and optional bitstream encryption on “S” versions.
• Package & Mounting  672-ball BGA (supplier package: 672-FPBGA, 27×27 mm) surface-mount package for compact board footprint and high-density routing.
• Power & Operating Range  Core supply range 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C. RoHS compliant.

Typical Applications

• High-Speed Serial Communications  Implement PCI Express, Ethernet and other serial protocols using the device’s SERDES and programmable I/O.
• Signal Processing & DSP Acceleration  Offload filtering, FFTs, and arithmetic-heavy tasks to on-chip sysDSP blocks and embedded RAM.
• Memory Interface & Buffering  Use embedded RAM and dedicated DDR support at the family level for memory controllers, buffering and data path staging.
• System Integration & Glue Logic  High logic capacity and 372 I/Os make the device suitable for consolidating multiple functions and implementing complex board-level control.

Unique Advantages

• Substantial On-Chip Resources:  Approximately 48,000 logic elements and several Mbits of embedded RAM reduce external component count and simplify system design.
• High I/O Density:  372 I/Os enable broad peripheral connectivity and multi-channel interfacing without additional IO expanders.
• Serial Link Capability:  Family SERDES support for 250 Mbps–3.125 Gbps links enables integration of contemporary high-speed protocols.
• Dedicated DSP Support:  sysDSP blocks accelerate arithmetic workloads, improving processing throughput for real-time signal tasks.
• Compact, Board-Friendly Package:  672-ball BGA (27×27 mm) offers a high-density, surface-mount solution for space-constrained designs.
• Commercial-Grade Availability:  Specified for 0 °C to 85 °C operation with RoHS compliance for standard commercial applications.

Why Choose LFE2M50SE-6FN672C?

The LFE2M50SE-6FN672C combines a large programmable fabric, ample embedded memory and a high pin count in a compact 672-ball BGA package—making it well suited for communication, networking and DSP-centric embedded systems that need on-chip integration and flexible I/O. Family-level features such as embedded SERDES, dedicated DSP blocks and robust clocking resources provide a balanced platform for designs that require both logic density and high-speed connectivity.

This device is appropriate for engineers and teams looking to consolidate multiple discrete functions into a single programmable IC, reduce BOM complexity, and leverage Lattice ECP2M family capabilities in commercial-temperature designs.

Request a quote or submit a pricing and availability inquiry to receive lead-time and ordering information for the LFE2M50SE-6FN672C.