LFE2M50SE-6FN900C

The LFE2M50SE-6FN900C is an ECP2M-series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a high-density programmable logic fabric with a large I/O count and substantial on-chip memory, packaged in a 900-ball BGA for surface-mount applications.

Designed for commercial-grade systems, this device targets designs that require up to 48,000 logic elements, approximately 4.25 Mbits of embedded memory, and up to 410 I/O signals while operating within a 1.14 V to 1.26 V core supply range and a 0 °C to 85 °C temperature window.

Key Features

• Logic Capacity  Up to 48,000 logic elements to implement complex programmable logic and custom hardware functions.
• Embedded Memory  Approximately 4.25 Mbits of on-chip RAM for data buffering, state storage, and memory-backed logic functions.
• I/O Density  Supports up to 410 I/O pins to accommodate wide parallel interfaces, multi-channel signaling, and extensive peripheral connectivity.
• Packaging  900-BBGA package (supplier device package: 900-FPBGA, 31 × 31 mm) optimized for surface-mount assembly and high pin-count board layouts.
• Power  Core supply voltage range of 1.14 V to 1.26 V for compatibility with targeted power domains and regulator designs.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• RoHS Compliance  RoHS-compliant manufacturing for regulatory alignment and reduced hazardous substances.

Typical Applications

• Programmable Logic and Prototyping  Implement custom logic functions, hardware accelerators, and design prototypes that require substantial logic capacity and on-chip memory.
• I/O-Intensive Interfaces  Drive wide parallel buses, interface with multiple peripherals, or consolidate I/O routing using the device's high pin count.
• Embedded Data Handling  Use on-chip RAM for buffering, packet handling, or intermediate storage in data-path designs.
• System Integration  Integrate custom peripherals and glue-logic to reduce external components and streamline board-level design.

Unique Advantages

• High Logic Density: 48,000 logic elements enable implementation of complex, multi-function designs on a single FPGA.
• Substantial Embedded Memory: Approximately 4.25 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-holding needs.
• Extensive I/O Capability: 410 I/O pins support dense external interfacing and flexible board-level connectivity.
• Compact High-Pin Package: 900-ball BGA (31 × 31 mm) provides the pin count required for high-density designs while remaining suitable for surface-mount assembly.
• Commercial-Grade Operating Range: Rated for 0 °C to 85 °C operation for a wide range of standard commercial applications.
• Regulatory Alignment: RoHS-compliant construction supports environmental and regulatory requirements.

Why Choose LFE2M50SE-6FN900C?

The LFE2M50SE-6FN900C delivers a combination of high logic capacity, generous on-chip memory, and a large I/O complement in a compact 900-BBGA package from Lattice Semiconductor Corporation. Its specification set makes it well suited to commercial embedded designs that require significant programmable logic, extensive interfacing, and on-device buffering.

Engineers and procurement teams can rely on this part for scalable hardware implementation where integration, pin count, and memory resources are key selection criteria. The commercial-grade temperature range and RoHS compliance provide alignment with common product development and manufacturing requirements.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2M50SE-6FN900C. Our team will respond with the information needed to move your design forward.