LFE2M50SE-7F900C

The LFE2M50SE-7F900C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor’s ECP2M family. It provides a high-density combination of logic, embedded memory, and I/O in a compact 900-ball BGA package for commercial-grade programmable logic designs.

With 48,000 logic elements, approximately 4.25 Mbits of embedded RAM, and up to 410 I/Os, this device targets applications that require substantial on-chip resources and high I/O density while operating within standard commercial temperature and supply ranges.

Key Features

• Core Logic 48,000 logic elements provide substantial programmable resources for complex digital functions and custom logic implementations.
• Embedded Memory Approximately 4.25 Mbits of on-chip RAM to support buffering, lookup tables, and state storage for data-intensive logic tasks.
• I/O Density Up to 410 I/Os to support broad interfacing needs and high pin-count system connectivity.
• Package and Mounting Supplied in a 900-BBGA (900-FPBGA, 31×31 mm) surface-mount package to meet compact board layouts and high-density assembly requirements.
• Power Supply Operates from a 1.14 V to 1.26 V supply range, suitable for the device’s core power domain.
• Operating Range Commercial temperature rating from 0 °C to 85 °C for standard commercial-environment deployments.
• Environmental Compliance RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• High-density I/O systems — Use the device’s 410 I/Os to aggregate and route multiple signals in systems requiring broad external connectivity.
• Custom digital processing — Leverage 48,000 logic elements and embedded RAM to implement tailored data paths, protocol handling, and control logic.
• Prototyping and evaluation — The combination of logic density and on-chip memory makes this FPGA suitable for developing and validating complex digital designs.

Unique Advantages

• High programmable capacity: 48,000 logic elements enable complex custom logic and parallel processing architectures on a single device.
• Substantial embedded memory: Approximately 4.25 Mbits of on-chip RAM reduce dependence on external memory for many buffering and state-storage needs.
• Large I/O count: Up to 410 I/Os simplify board-level routing and reduce the need for external multiplexing or I/O expanders.
• Compact BGA footprint: 900-ball FPBGA (31×31 mm) provides a space-efficient package for high-density PCB designs.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose LFE2M50SE-7F900C?

The LFE2M50SE-7F900C combines a large pool of logic elements, substantial on-chip memory, and high I/O count in a compact 900-BBGA package, making it well suited for commercial projects that require significant programmable resources and dense board integration. Its voltage and temperature specifications align with common commercial designs, while RoHS compliance supports regulated manufacturing processes.

This FPGA is appropriate for engineers and teams building complex digital systems, high-density I/O controllers, or prototype platforms where integrated logic capacity and embedded memory reduce external components and simplify system design.

Request a quote or submit an inquiry to discuss pricing, availability, and lead time for the LFE2M50SE-7F900C. Our team can help evaluate its fit for your next programmable logic design.