LFE2M50SE-7FN900C

IC FPGA 410 I/O 900FBGA
Part Description

ECP2M Field Programmable Gate Array (FPGA) IC 410 4246528 48000 900-BBGA

Quantity 15 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package900-FPBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case900-BBGANumber of I/O410Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells48000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4246528

Overview of LFE2M50SE-7FN900C – ECP2M Field Programmable Gate Array (FPGA) IC 410 4246528 48000 900-BBGA

The LFE2M50SE-7FN900C is a commercial-grade Field Programmable Gate Array (FPGA) offering a combination of high logic capacity, on-chip memory, and a large I/O count in a compact ball-grid array package. It provides 48,000 logic elements and approximately 4.25 Mbits of embedded memory, enabling programmable logic for mid- to high-complexity designs.

Engineered for surface-mount assembly, the device operates from a 1.14 V to 1.26 V supply and supports an ambient operating range of 0 °C to 85 °C. The device is RoHS compliant and is supplied in a 900-ball FPBGA (31 × 31 mm) package.

Key Features

  • Core Logic  48,000 logic elements to implement programmable logic, state machines, and custom digital functions.
  • Embedded Memory  Approximately 4.25 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic.
  • I/O Capacity  410 I/O pins to support a wide range of external interfaces and parallel/connectivity requirements.
  • Power  Operates from a core supply range of 1.14 V to 1.26 V to meet low-voltage design constraints.
  • Package & Mounting  900-BBGA (supplier device package: 900-FPBGA, 31 × 31 mm) in a surface-mount form factor for compact board layouts.
  • Temperature & Grade  Commercial grade operation across 0 °C to 85 °C for standard embedded and commercial applications.
  • Environmental Compliance  RoHS compliant to support lead-free manufacturing processes.

Unique Advantages

  • High logic capacity: 48,000 logic elements provide ample programmable resources for complex custom logic without increasing board-level component count.
  • Substantial embedded memory: Approximately 4.25 Mbits of on-chip RAM reduces dependence on external memory and lowers system latency for data-intensive tasks.
  • Extensive I/O count: 410 I/O pins enable broad interfacing options, simplifying integration with peripherals and external subsystems.
  • Compact BGA packaging: 900-FPBGA (31 × 31 mm) allows high-density system designs while retaining surface-mount assembly compatibility.
  • Low-voltage core operation: 1.14 V to 1.26 V supply range supports modern low-power design disciplines and power-rail planning.
  • RoHS compliant: Meets lead-free manufacturing requirements for commercial electronics production.

Why Choose LFE2M50SE-7FN900C?

The LFE2M50SE-7FN900C delivers a balanced combination of logic capacity, embedded memory, and I/O density in a commercial-grade FPGA package. Its specifications make it suitable for designers who need significant on-chip resources and a large number of external connections in a compact, surface-mount form factor.

Selecting this part provides scalability and integration for a range of programmable logic tasks while ensuring compliance with RoHS requirements. It is well suited to teams seeking a mid- to high-capacity FPGA option with clear electrical and thermal operating parameters.

Request a quote or submit a purchase inquiry to get pricing and availability information for the LFE2M50SE-7FN900C.

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