LFE2M50SE-7FN900C
| Part Description |
ECP2M Field Programmable Gate Array (FPGA) IC 410 4246528 48000 900-BBGA |
|---|---|
| Quantity | 15 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 900-FPBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 900-BBGA | Number of I/O | 410 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 48000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4246528 |
Overview of LFE2M50SE-7FN900C – ECP2M Field Programmable Gate Array (FPGA) IC 410 4246528 48000 900-BBGA
The LFE2M50SE-7FN900C is a commercial-grade Field Programmable Gate Array (FPGA) offering a combination of high logic capacity, on-chip memory, and a large I/O count in a compact ball-grid array package. It provides 48,000 logic elements and approximately 4.25 Mbits of embedded memory, enabling programmable logic for mid- to high-complexity designs.
Engineered for surface-mount assembly, the device operates from a 1.14 V to 1.26 V supply and supports an ambient operating range of 0 °C to 85 °C. The device is RoHS compliant and is supplied in a 900-ball FPBGA (31 × 31 mm) package.
Key Features
- Core Logic 48,000 logic elements to implement programmable logic, state machines, and custom digital functions.
- Embedded Memory Approximately 4.25 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic.
- I/O Capacity 410 I/O pins to support a wide range of external interfaces and parallel/connectivity requirements.
- Power Operates from a core supply range of 1.14 V to 1.26 V to meet low-voltage design constraints.
- Package & Mounting 900-BBGA (supplier device package: 900-FPBGA, 31 × 31 mm) in a surface-mount form factor for compact board layouts.
- Temperature & Grade Commercial grade operation across 0 °C to 85 °C for standard embedded and commercial applications.
- Environmental Compliance RoHS compliant to support lead-free manufacturing processes.
Unique Advantages
- High logic capacity: 48,000 logic elements provide ample programmable resources for complex custom logic without increasing board-level component count.
- Substantial embedded memory: Approximately 4.25 Mbits of on-chip RAM reduces dependence on external memory and lowers system latency for data-intensive tasks.
- Extensive I/O count: 410 I/O pins enable broad interfacing options, simplifying integration with peripherals and external subsystems.
- Compact BGA packaging: 900-FPBGA (31 × 31 mm) allows high-density system designs while retaining surface-mount assembly compatibility.
- Low-voltage core operation: 1.14 V to 1.26 V supply range supports modern low-power design disciplines and power-rail planning.
- RoHS compliant: Meets lead-free manufacturing requirements for commercial electronics production.
Why Choose LFE2M50SE-7FN900C?
The LFE2M50SE-7FN900C delivers a balanced combination of logic capacity, embedded memory, and I/O density in a commercial-grade FPGA package. Its specifications make it suitable for designers who need significant on-chip resources and a large number of external connections in a compact, surface-mount form factor.
Selecting this part provides scalability and integration for a range of programmable logic tasks while ensuring compliance with RoHS requirements. It is well suited to teams seeking a mid- to high-capacity FPGA option with clear electrical and thermal operating parameters.
Request a quote or submit a purchase inquiry to get pricing and availability information for the LFE2M50SE-7FN900C.

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