LFE2M70E-5FN1152I

The LFE2M70E-5FN1152I is an industrial‑grade Field Programmable Gate Array (FPGA) from the Lattice ECP2M family. It provides a programmable fabric with approximately 67,000 logic elements, abundant on‑chip memory and a high I/O count in a 1152‑ball BGA package.

Designed for high‑density, high‑integration applications, this device targets communications and embedded systems that require flexible serial interfaces, DSP acceleration and a wide set of programmable I/O standards while operating across an industrial temperature range.

Key Features

• Logic Capacity — Approximately 67,000 logic elements and 8,375 configurable logic blocks (CLBs) for implementing complex digital functions.
• Embedded Memory — Approximately 4.64 Mbits of on‑chip RAM (4,642,816 bits) to support large buffering and state storage within the FPGA fabric.
• I/O Density — 436 user I/Os available to support wide parallel interfaces and multiple peripheral connections.
• Embedded SERDES (ECP2M family) — High‑speed serial capability with data rates from 250 Mbps to 3.125 Gbps and up to 16 channels per device (family feature).
• DSP and Arithmetic — sysDSP blocks for multiply‑accumulate operations (family support for multiple sysDSP blocks to accelerate signal processing).
• Clocking — Integrated PLLs and DLLs (family supports two GPLLs and up to six SPLLs) for flexible clock management and dynamic adjustment.
• Flexible I/O Standards — Programmable I/O buffer support across a broad set of interfaces (LVTTL, LVCMOS, LVDS, SSTL, HSTL and others as provided by the family).
• Package & Mounting — 1152‑BBGA (supplier package: 1152‑FPBGA, 35 × 35 mm), surface‑mount mounting type for compact PCB integration.
• Power & Temperature — Core supply range 1.14 V to 1.26 V; industrial operating temperature range −40 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑Speed Communications — Protocol processing and bridging for PCI Express, 1 GbE/SGMII, OBSAI, CPRI and Serial RapidIO using the family’s embedded SERDES.
• Network & Infrastructure — Packet processing, interface aggregation and timing‑sensitive functions that benefit from plentiful I/Os, embedded memory and sysDSP acceleration.
• Embedded Signal Processing — DSP‑heavy tasks such as filtering, sample buffering and real‑time arithmetic using sysDSP blocks and on‑chip RAM.
• Memory Interfaces & Data Acquisition — Source‑synchronous DDR/DDR2 interface support and dedicated I/O gearing for high‑throughput sensor or ADC/DAC front ends (family capabilities).

Unique Advantages

• High integration density: Large logic capacity (≈67k logic elements) reduces external glue logic and consolidates functions into a single device.
• Substantial embedded memory: Approximately 4.64 Mbits of on‑chip RAM supports deep buffering, FIFOs and state storage without external SRAM.
• High I/O count and flexible standards: 436 I/Os with programmable standards enable interfacing to a wide range of peripherals and high‑speed buses.
• Industrial temperature capability: Rated for −40 °C to 100 °C for reliability in industrial and demanding ambient environments.
• Compact BGA package: 1152‑ball FPBGA (35 × 35 mm) delivers high pin density in a compact footprint for space‑constrained boards.
• Low‑voltage core: Operates with a core supply between 1.14 V and 1.26 V to match system power architectures.

Why Choose LFE2M70E-5FN1152I?

The LFE2M70E-5FN1152I combines a high logic element count, substantial on‑chip memory and a large number of I/Os in an industrial‑rated package, making it well suited for complex communications, networking and embedded signal‑processing designs. Its family features — including embedded SERDES, sysDSP blocks and flexible clocking — enable designers to implement high‑throughput and timing‑sensitive functions while keeping BOM and board complexity under control.

This device is appropriate for development teams and procurement groups targeting scalable FPGA integration for industrial and communications equipment, where long‑term availability, a robust feature set and a compact BGA footprint are important.

Request a quote or submit an inquiry to get pricing, lead‑time and availability for the LFE2M70E-5FN1152I. Our team can help with volume needs and delivery scheduling.