LFE2M70E-5FN1152C

The LFE2M70E-5FN1152C is an ECP2M family Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA package. It integrates 67,000 logic elements, approximately 4.64 Mbits of on-chip RAM, and 436 user I/O pins to support complex digital designs that require significant logic and memory resources.

Designed for commercial-grade applications, this surface-mount FPGA operates from a low-voltage supply (1.14 V to 1.26 V) and within an operating temperature range of 0 °C to 85 °C, providing a compact, high-density option for system integration.

Key Features

• Core Logic — 67,000 logic elements to implement large-scale combinational and sequential logic functions within a single device.
• On-chip Memory — Total RAM bits: 4,642,816, providing approximately 4.64 Mbits of embedded memory for buffering, lookup tables, and state storage.
• High I/O Count — 436 user I/O pins to support a wide range of interfaces and parallel connections.
• Package & Mounting — 1152-BBGA package (supplier device package: 1152-FPBGA, 35 × 35 mm) in a surface-mount form factor for high-density PCB assembly.
• Low-Voltage Operation — Voltage supply range from 1.14 V to 1.26 V, suitable for systems with tight power rails.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial deployments.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Unique Advantages

• High logic density: 67,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial on-chip RAM: Approximately 4.64 Mbits of embedded RAM supports data buffering and state-heavy algorithms without external memory.
• Large I/O complement: 436 I/Os allow flexible connectivity to peripherals, sensors, and parallel busses, minimizing the need for external multiplexing.
• Compact BGA footprint: 1152-BBGA (1152-FPBGA, 35×35 mm) offers a space-efficient package for dense system layouts and surface-mount assembly.
• Low-voltage compatibility: Narrow supply range (1.14–1.26 V) supports designs targeting modern low-voltage power domains.
• Environmentally compliant: RoHS compliance simplifies qualification for regulated production environments.

Why Choose LFE2M70E-5FN1152C?

The LFE2M70E-5FN1152C positions itself as a high-density, commercially rated FPGA option for designs that demand a large logic fabric, considerable on-chip RAM, and broad I/O capability in a compact BGA package. Its combination of 67,000 logic elements, roughly 4.64 Mbits of RAM, and 436 I/Os makes it suitable for complex digital systems where board space and integration are priorities.

Engineers and procurement teams looking for a surface-mount, commercial-grade FPGA with defined operating voltage and temperature limits can evaluate this part where on-chip resources and a high pin count are required. RoHS compliance and standard BGA packaging help streamline manufacturing and environmental compliance efforts.

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